D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Data Device Corporation |
Parts packaging code | DIP |
package instruction | DIP, DIP24,.6 |
Contacts | 24 |
Reach Compliance Code | unknow |
ECCN code | 3A001.A.2.C |
Maximum analog output voltage | 0.5 V |
Converter type | D/A CONVERTER |
Enter bit code | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
Input format | PARALLEL, WORD |
JESD-30 code | R-CDIP-P24 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.0125% |
Nominal negative supply voltage | -15 V |
Number of digits | 12 |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | -1.3,+-15 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum stabilization time | |
Nominal settling time (tstl) | 0.035 µs |
Maximum slew rate | 125 mA |
Nominal supply voltage | 15 V |
surface mount | NO |
technology | HYBRID |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
DAC-02315-102 | DAC-02315-112 | DAC-02315-312 | DAC-02315-322 | DAC-02315-122 | DAC-02315-302 | |
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Description | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 0.035us Settling Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 | DIP, DIP24,.6 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, DDIP-24 |
Contacts | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknow |
Maximum analog output voltage | 0.5 V | 0.5 V | 0.5 V | 0.5 V | 0.5 V | 0.5 V |
Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
Enter bit code | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
Input format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
JESD-30 code | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 |
Maximum linear error (EL) | 0.0125% | 0.0125% | 0.0125% | 0.0125% | 0.0125% | 0.0125% |
Nominal negative supply voltage | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
Number of digits | 12 | 12 | 12 | 12 | 12 | 12 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
Nominal settling time (tstl) | 0.035 µs | 0.035 µs | 0.035 µs | 0.035 µs | 0.035 µs | 0.035 µs |
Maximum slew rate | 125 mA | 125 mA | 125 mA | 125 mA | 125 mA | 125 mA |
Nominal supply voltage | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
surface mount | NO | NO | NO | NO | NO | NO |
Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
Is it Rohs certified? | incompatible | incompatible | - | - | incompatible | incompatible |
Maker | Data Device Corporation | Data Device Corporation | - | - | Data Device Corporation | Data Device Corporation |
JESD-609 code | e0 | e0 | - | - | e0 | e0 |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | - | - | DIP24,.6 | DIP24,.6 |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
power supply | -1.3,+-15 V | -1.3,+-15 V | - | - | -1.3,+-15 V | -1.3,+-15 V |
technology | HYBRID | HYBRID | - | - | HYBRID | HYBRID |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |