MR20H40CDFR datasheet, PDF - EEWORLD Datasheet

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MR20H40CDFR: DescriptionMemory Circuit, 512KX8, CMOS, PDSO8, DFN-8; Categorystorage storage; File Size2MB，30 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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MR20H40CDFR Overview

Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8

MR20H40CDFR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
Parts packaging code	SON
package instruction	DFN-8
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Samacsys Description	NVRAM 4Mb 3.3V 50Mhz 512K x 8 SPI
JESD-30 code	R-PDSO-N8
length	6 mm
memory density	4194304 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Mixed memory types	N/A
Humidity sensitivity level	3
Number of functions	1
Number of terminals	8
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Encapsulate equivalent code	SOLCC8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	0.9 mm
Maximum standby current	0.00075 A
Maximum slew rate	0.0465 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	5 mm

MR20H40CDFR Related Products

	MR20H40CDFR	MR25H40CDC	MR25H40CDCR	MR25H40CDF	MR25H40MDF	MR20H40DF	MR20H40DFR
Description	Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8	Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8	Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8	Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8	Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8	Memory Circuit, 512KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8	Memory Circuit, 512KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8
Maker	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies
Parts packaging code	SON	SON	SON	SON	SON	SON	SON
package instruction	DFN-8	SON, SOLCC8,.25	SON, SOLCC8,.25	DFN-8	DFN-8	HVSON,	HVSON,
Contacts	8	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8	R-PDSO-N8
length	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm	6 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	125 °C	70 °C	70 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVSON	SON	SON	HVSON	HVSON	HVSON	HVSON
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Maximum seat height	0.9 mm	1.05 mm	1.05 mm	0.9 mm	0.9 mm	0.9 mm	0.9 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	5 mm	5 mm	5 mm	5 mm	5 mm	5 mm	5 mm
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	-
Mixed memory types	N/A	N/A	N/A	N/A	N/A	-	-
Humidity sensitivity level	3	-	-	3	3	3	-
Encapsulate equivalent code	SOLCC8,.25	SOLCC8,.25	SOLCC8,.25	SOLCC8,.25	SOLCC8,.25	-	-
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	260	260	260	-
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-
Maximum time at peak reflow temperature	40	NOT SPECIFIED	NOT SPECIFIED	40	40	40	-

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