Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Everspin Technologies |
| Parts packaging code | SON |
| package instruction | SON, SOLCC8,.25 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| JESD-30 code | R-PDSO-N8 |
| length | 6 mm |
| memory density | 4194304 bit |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 8 |
| Mixed memory types | N/A |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 512KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SON |
| Encapsulate equivalent code | SOLCC8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.05 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 5 mm |
| MR25H40CDC | MR25H40CDCR | MR25H40CDF | MR25H40MDF | MR20H40CDFR | MR20H40DF | MR20H40DFR | |
|---|---|---|---|---|---|---|---|
| Description | Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8 | Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8 | Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8 | Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8 | Memory Circuit, 512KX8, CMOS, PDSO8, DFN-8 | Memory Circuit, 512KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8 | Memory Circuit, 512KX8, CMOS, PDSO8, 5 X 6 MM, ROHS COMPLIANT, MO-229, DFN-8 |
| Maker | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies |
| Parts packaging code | SON | SON | SON | SON | SON | SON | SON |
| package instruction | SON, SOLCC8,.25 | SON, SOLCC8,.25 | DFN-8 | DFN-8 | DFN-8 | HVSON, | HVSON, |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 code | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
| length | 6 mm | 6 mm | 6 mm | 6 mm | 6 mm | 6 mm | 6 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 70 °C | 70 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
| organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SON | SON | HVSON | HVSON | HVSON | HVSON | HVSON |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Maximum seat height | 1.05 mm | 1.05 mm | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | - |
| Mixed memory types | N/A | N/A | N/A | N/A | N/A | - | - |
| Encapsulate equivalent code | SOLCC8,.25 | SOLCC8,.25 | SOLCC8,.25 | SOLCC8,.25 | SOLCC8,.25 | - | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | 260 | 260 | - |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 | 40 | 40 | - |
| Humidity sensitivity level | - | - | 3 | 3 | 3 | 3 | - |
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