EEPROM, 64X16, Serial, CMOS, PDSO8, 4.40 MM, LEAD AND HALOGEN FREE, PLASTIC, MO-153AA, TSSOP-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Atmel (Microchip) |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, SOP8,.25 |
| Contacts | 8 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Spare memory width | 8 |
| Maximum clock frequency (fCLK) | 1 MHz |
| Data retention time - minimum | 100 |
| Durability | 1000000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e3 |
| length | 4.4 mm |
| memory density | 1024 bi |
| Memory IC Type | EEPROM |
| memory width | 16 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 64 words |
| character code | 64 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| organize | 64X16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Serial bus type | MICROWIRE |
| Maximum standby current | 0.00001 A |
| Maximum slew rate | 0.002 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3 mm |
| Maximum write cycle time (tWC) | 10 ms |
| write protect | SOFTWARE |
| AT93C46-10TQ-2.7 | AT93C66-10SA-5.0C | AT93C46R-10SU-2.7 | AT93C46-10SQ-2.7 | AT93C46-10PQ-2.7 | |
|---|---|---|---|---|---|
| Description | EEPROM, 64X16, Serial, CMOS, PDSO8, 4.40 MM, LEAD AND HALOGEN FREE, PLASTIC, MO-153AA, TSSOP-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, MS-012AA, SOIC-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, MS-012AA, SOIC-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8 | EEPROM, 64X16, Serial, CMOS, PDIP8, 0.300 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-001BA, DIP-8 |
| Is it Rohs certified? | conform to | incompatible | conform to | conform to | conform to |
| Maker | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| Parts packaging code | TSSOP | SOIC | SOIC | SOIC | DIP |
| package instruction | TSSOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8 | DIP, |
| Contacts | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | unknown | unknown | unknown | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Spare memory width | 8 | 8 | 8 | 8 | 8 |
| Maximum clock frequency (fCLK) | 1 MHz | 2 MHz | 1 MHz | 1 MHz | 1 MHz |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
| JESD-609 code | e3 | e0 | e3 | e3 | e3 |
| length | 4.4 mm | 4.9 mm | 4.9 mm | 4.9 mm | 9.271 mm |
| memory density | 1024 bi | 4096 bit | 1024 bit | 1024 bit | 1024 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 16 | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 |
| word count | 64 words | 256 words | 64 words | 64 words | 64 words |
| character code | 64 | 256 | 64 | 64 | 64 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 64X16 | 256X16 | 64X16 | 64X16 | 64X16 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | SOP | SOP | SOP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | 260 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.75 mm | 1.75 mm | 1.75 mm | 5.334 mm |
| Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V | 4.5 V | 2.7 V | 2.7 V | 2.7 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | NOT SPECIFIED | 40 | 40 | 40 |
| width | 3 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| Data retention time - minimum | 100 | 100 | 100 | 100 | - |
| Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - |
| Humidity sensitivity level | 1 | - | 1 | 1 | 1 |
| Encapsulate equivalent code | SOP8,.25 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | - |
| power supply | 3/5 V | 5 V | 3/5 V | 3/5 V | - |
| Maximum standby current | 0.00001 A | 0.00003 A | 0.00001 A | 0.00001 A | - |
| Maximum slew rate | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA | - |
| write protect | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | - |
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