EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Atmel (Microchip) |
Parts packaging code | SOIC |
package instruction | 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8 |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Spare memory width | 8 |
Maximum clock frequency (fCLK) | 1 MHz |
Data retention time - minimum | 100 |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3 |
length | 4.9 mm |
memory density | 1024 bit |
Memory IC Type | EEPROM |
memory width | 16 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 64 words |
character code | 64 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
organize | 64X16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | TSSOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/5 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Serial bus type | MICROWIRE |
Maximum standby current | 0.00001 A |
Maximum slew rate | 0.002 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 3.9 mm |
Maximum write cycle time (tWC) | 10 ms |
write protect | SOFTWARE |
AT93C46-10SQ-2.7 | AT93C66-10SA-5.0C | AT93C46R-10SU-2.7 | AT93C46-10PQ-2.7 | AT93C46-10TQ-2.7 | |
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Description | EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8 | EEPROM, 256X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, MS-012AA, SOIC-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, MS-012AA, SOIC-8 | EEPROM, 64X16, Serial, CMOS, PDIP8, 0.300 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-001BA, DIP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, 4.40 MM, LEAD AND HALOGEN FREE, PLASTIC, MO-153AA, TSSOP-8 |
Is it Rohs certified? | conform to | incompatible | conform to | conform to | conform to |
Maker | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
Parts packaging code | SOIC | SOIC | SOIC | DIP | TSSOP |
package instruction | 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, | TSSOP, SOP8,.25 |
Contacts | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | compli | compli |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Spare memory width | 8 | 8 | 8 | 8 | 8 |
Maximum clock frequency (fCLK) | 1 MHz | 2 MHz | 1 MHz | 1 MHz | 1 MHz |
JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
JESD-609 code | e3 | e0 | e3 | e3 | e3 |
length | 4.9 mm | 4.9 mm | 4.9 mm | 9.271 mm | 4.4 mm |
memory density | 1024 bit | 4096 bit | 1024 bit | 1024 bi | 1024 bi |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 16 | 16 | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 8 | 8 | 8 | 8 |
word count | 64 words | 256 words | 64 words | 64 words | 64 words |
character code | 64 | 256 | 64 | 64 | 64 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 64X16 | 256X16 | 64X16 | 64X16 | 64X16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP | SOP | DIP | TSSOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.75 mm | 1.75 mm | 1.75 mm | 5.334 mm | 1.2 mm |
Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 2.7 V | 4.5 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE |
Terminal surface | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) |
Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.65 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 40 | NOT SPECIFIED | 40 | 40 | 40 |
width | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3 mm |
Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
Data retention time - minimum | 100 | 100 | 100 | - | 100 |
Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles |
Humidity sensitivity level | 1 | - | 1 | 1 | 1 |
Encapsulate equivalent code | TSSOP8,.25 | SOP8,.25 | SOP8,.25 | - | SOP8,.25 |
power supply | 3/5 V | 5 V | 3/5 V | - | 3/5 V |
Maximum standby current | 0.00001 A | 0.00003 A | 0.00001 A | - | 0.00001 A |
Maximum slew rate | 0.002 mA | 0.002 mA | 0.002 mA | - | 0.002 mA |
write protect | SOFTWARE | SOFTWARE | SOFTWARE | - | SOFTWARE |