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AT93C46-10SQ-2.7

Description
EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8
Categorystorage    storage   
File Size302KB,21 Pages
ManufacturerAtmel (Microchip)
Environmental Compliance
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AT93C46-10SQ-2.7 Overview

EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8

AT93C46-10SQ-2.7 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerAtmel (Microchip)
Parts packaging codeSOIC
package instruction0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Spare memory width8
Maximum clock frequency (fCLK)1 MHz
Data retention time - minimum100
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
memory density1024 bit
Memory IC TypeEEPROM
memory width16
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count64 words
character code64
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize64X16
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeTSSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Serial bus typeMICROWIRE
Maximum standby current0.00001 A
Maximum slew rate0.002 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9 mm
Maximum write cycle time (tWC)10 ms
write protectSOFTWARE

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Description EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8 EEPROM, 256X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, MS-012AA, SOIC-8 EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, MS-012AA, SOIC-8 EEPROM, 64X16, Serial, CMOS, PDIP8, 0.300 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-001BA, DIP-8 EEPROM, 64X16, Serial, CMOS, PDSO8, 4.40 MM, LEAD AND HALOGEN FREE, PLASTIC, MO-153AA, TSSOP-8
Is it Rohs certified? conform to incompatible conform to conform to conform to
Maker Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code SOIC SOIC SOIC DIP TSSOP
package instruction 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8 SOP, SOP8,.25 SOP, SOP8,.25 DIP, TSSOP, SOP8,.25
Contacts 8 8 8 8 8
Reach Compliance Code unknown unknown unknown compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Spare memory width 8 8 8 8 8
Maximum clock frequency (fCLK) 1 MHz 2 MHz 1 MHz 1 MHz 1 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8
JESD-609 code e3 e0 e3 e3 e3
length 4.9 mm 4.9 mm 4.9 mm 9.271 mm 4.4 mm
memory density 1024 bit 4096 bit 1024 bit 1024 bi 1024 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 16 16 16 16 16
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
word count 64 words 256 words 64 words 64 words 64 words
character code 64 256 64 64 64
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 85 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
organize 64X16 256X16 64X16 64X16 64X16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP DIP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.75 mm 1.75 mm 5.334 mm 1.2 mm
Serial bus type MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.7 V 4.5 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE INDUSTRIAL AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn) MATTE TIN Matte Tin (Sn)
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 NOT SPECIFIED 40 40 40
width 3.9 mm 3.9 mm 3.9 mm 7.62 mm 3 mm
Maximum write cycle time (tWC) 10 ms 10 ms 10 ms 10 ms 10 ms
Data retention time - minimum 100 100 100 - 100
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles
Humidity sensitivity level 1 - 1 1 1
Encapsulate equivalent code TSSOP8,.25 SOP8,.25 SOP8,.25 - SOP8,.25
power supply 3/5 V 5 V 3/5 V - 3/5 V
Maximum standby current 0.00001 A 0.00003 A 0.00001 A - 0.00001 A
Maximum slew rate 0.002 mA 0.002 mA 0.002 mA - 0.002 mA
write protect SOFTWARE SOFTWARE SOFTWARE - SOFTWARE

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