EEWORLDEEWORLDEEWORLD

Part Number

Search

1206H2500270GQB

Description
Ceramic Capacitor, Multilayer, Ceramic, 250V, 2% +Tol, 2% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1206, CHIP
CategoryPassive components    capacitor   
File Size695KB,2 Pages
ManufacturerSyfer
Download Datasheet Parametric View All

1206H2500270GQB Overview

Ceramic Capacitor, Multilayer, Ceramic, 250V, 2% +Tol, 2% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1206, CHIP

1206H2500270GQB Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSyfer
package instruction, 1206
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.000027 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.6 mm
JESD-609 codee0
length3.2 mm
Manufacturer's serial number1206
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance2%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK
positive tolerance2%
Rated (DC) voltage (URdc)250 V
seriesSIZE(HIGH Q)
size code1206
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceTin/Lead (Sn90Pb10) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width1.6 mm
High Q
Capacitors
MS Range
The Syfer MS range offers a
very stable, High Q material
system that provides excellent,
low loss performance in
systems below 3GHz. The
range is available in 0402 to
3640 case sizes with various
termination options including
FlexiCap™. This range of high
frequency capacitors is suitable
for many applications where
economical, high performance
is required.
Specification
Capacitance Values
See Capacitance table overleaf
Mechanical
Termination Material
See Ordering Information overleaf
Solderability
IEC 60068-2-58
Printing
Consult sales office
Lead Free Soldering
Termination codes J and Y ranges are
fully compliant with the RoHS and WEEE
directives and parts are compatible
with lead free solders.
Climatic Category
55/125/56
Reeled Quantities
See Capacitance table overleaf
Electrical
Operating Temperature
-55°C to +125°C
Temperature Coefficient
(Typical)
0 ± 30 ppm/°C
Insulation resistance at +25°C
>100GΩ
Insulation resistance at +125°C
>10GΩ
Ageing rate
None
Piezoelectric Effects
None
Dielectric Absorption
None
Dimensions
L1
T
SA
AR MPLE
REF E AVA KITS
IL
E
OR R TO ABLE
S
S
FOR YFER ALES
DET .COM
AIL
S
W
L2
Size
0402
0505
0603
0805
1206
1111
1210
1812
2220
2225
38/09
3640
Length (L1)
mm (inches)
1.00 ± 0.10 (0.039 ± 0.004)
1.40 ± 0.38 (0.055 ± 0.015)
1.60 ± 0.20 (0.063 ± 0.008)
2.00 ± 0.30 (0.080 ± 0.012)
3.20 ± 0.30 (0.126 ± 0.012)
2.79 +0.51 -0.25 (0.11 +0.02 -0.01)
3.20 ± 0.30 (0.126 ± 0.012)
4.50 ± 0.35 (0.180 ± 0.014)
5.70 ± 0.40 (0.225 ± 0.016)
5.70 ± 0.40 (0.225 ± 0.016)
9.15 ± 0.50 (0.360 ± 0.020)
Width (W)
mm (inches)
0.50 ± 0.10 (0.020 ± 0.004)
1.40 ± 0.25 (0.055 ± 0.010)
0.80 ± 0.20 (0.031 ± 0.008)
1.27 ± 0.20 (0.050 ± 0.008)
1.60 ± 0.20 (0.063 ± 0.008)
2.79 ± 0.38 (0.110 ± 0.015)
2.50 ± 0.30 (0.100 ± 0.012)
3.20 ± 0.30 (0.126 ± 0.012)
5.00 ± 0.40 (0.197 ± 0.016)
6.30 ± 0.40 (0.250 ± 0.016)
10.16 ± 0.50 (0.400 ± 0.020)
Thickness (T)
mm (inches)
Termination Band (L2)
mm (inches)
min
max
0.40 (0.016)
0.50 (0.020)
0.40 (0.016)
0.75 (0.030)
0.75 (0.030)
0.63 (0.025)
0.75 (0.030)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.50 (0.059)
0.10 (0.004)
0.13 (0.005)
0.10 (0.004)
0.13 (0.005)
0.25 (0.010)
0.13 (0.005)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.50 (0.020)
0.60 max (0.024 max)
1.27 max (0.050 max)
0.80 max (0.031 max)
1.30 max (0.051 max)
1.70 max (0.067 max)
2.54 max (0.100 max)
2.00 max (0.079 max)
2.50 max (0.098 max)
2.50 max (0.098 max)
2.50 max (0.098 max)
2.50 max (0.098 max)
PCB panelization skills
Panelization refers to having the manufacturer directly assemble small PCB boards into a whole piece.1. Why do we need to plywood? In other words, what are the benefits of plywood?1. In order to meet ...
可乐zzZ MCU
Microchip Q&A | New MCU Core Independent Peripheral (CIP) Technology Decryption
Participate in the Microchip Quiz Event to decipher the unique features of Microchip's new microcontrollers and have a chance to win rich gifts!!!Core independent peripherals (CIP) technology is now a...
dancerzj MCU
Various CCS compilation errors
1. When compiling the program with CCS, the following error is reported: DescriptionResourcePathLocationType make: *** missing separator.Stop.main.d/G2553_MPU6050/Debugline 19C/C++ ProblemThere is onl...
Jacktang DSP and ARM Processors
CCS project loading and debugging
1. Project compilation and operation First, compile the execution project. Right-click the project and click "Build Project" in the pop-up dialog box to compile the current project, as shown below:Aft...
fish001 DSP and ARM Processors
How did you electronic design engineers grow up?
I just graduated in July this year, and my current company is the one where I interned before. It's working on electronic circuit design. The company is relatively small, with less than a hundred peop...
小阿 Talking
Whenever there is a heavy rainstorm, I face frequent network outages.
Report the coordinates, a small town in a small county town in the countryside of Fuzhou. Whenever there is a heavy rainstorm, the network is intermittent, the broadband network is like this, and the ...
okhxyyo RF/Wirelessly

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号