K8S5715EZC-DC1D0 datasheet, PDF

K8S5715EZC-DC1D0: DescriptionFlash, 16MX16, 100ns, PBGA44, 7.70 X 6.20 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44; Categorystorage storage; File Size1MB，65 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K8S5715EZC-DC1D0 Overview

Flash, 16MX16, 100ns, PBGA44, 7.70 X 6.20 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	44
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	100 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 code	R-PBGA-B44
memory density	268435456 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	44
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
type	NOR TYPE

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