Flash, 8MX16, 80ns, PDSO56, 20 X 14 MM, HALOGEN FREE AND LEAD FREE, PLASTIC, TSOP1-56
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SAMSUNG |
Parts packaging code | TSOP1 |
package instruction | TSOP1, TSSOP56,.8,20 |
Contacts | 56 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Maximum access time | 80 ns |
Spare memory width | 8 |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PDSO-G56 |
length | 18.4 mm |
memory density | 134217728 bi |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of departments/size | 128 |
Number of terminals | 56 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP1 |
Encapsulate equivalent code | TSSOP56,.8,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
page size | 8/16 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.8/3.3,3/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.2 mm |
Department size | 128K |
Maximum standby current | 0.00004 A |
Maximum slew rate | 0.055 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | YES |
type | NOR TYPE |
width | 14 mm |