8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 40 |
Reach Compliance Code | unknow |
boundary scan | NO |
External data bus width | 8 |
JESD-30 code | R-CDIP-T40 |
JESD-609 code | e0 |
length | 50.8 mm |
low power mode | NO |
Humidity sensitivity level | NOT SPECIFIED |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output data bus width | 16 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | COMMERCIAL |
Maximum seat height | 4.29 mm |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, MULTIPLIER |
ADSP-1081AKD | ADSP-1081ASD | ADSP-1081ASD/883B | ADSP-1081AKN | ADSP-1081ATD | ADSP-1081AJD | |
---|---|---|---|---|---|---|
Description | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, PDIP40, PLASTIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
package instruction | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
Contacts | 40 | 40 | 40 | 40 | 40 | 40 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknow |
boundary scan | NO | NO | NO | NO | NO | NO |
External data bus width | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 code | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-PDIP-T40 | R-CDIP-T40 | R-CDIP-T40 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
low power mode | NO | NO | NO | NO | NO | NO |
Humidity sensitivity level | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 |
Maximum operating temperature | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C |
Output data bus width | 16 | 16 | 16 | 16 | 16 | 16 |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Maximum seat height | 4.29 mm | 4.29 mm | 4.29 mm | 5.08 mm | 4.29 mm | 4.29 mm |
Maximum supply voltage | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V |
Minimum supply voltage | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER |
Maker | Rochester Electronics | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics |
length | 50.8 mm | 50.8 mm | 50.8 mm | - | 50.8 mm | 50.8 mm |