8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| boundary scan | NO |
| External data bus width | 8 |
| JESD-30 code | R-CDIP-T40 |
| JESD-609 code | e0 |
| length | 50.8 mm |
| low power mode | NO |
| Humidity sensitivity level | NOT SPECIFIED |
| Number of terminals | 40 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output data bus width | 16 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | MILITARY |
| Maximum seat height | 4.29 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, MULTIPLIER |
| Base Number Matches | 1 |
| ADSP-1081ASD/883B | ADSP-1081ASD | ADSP-1081AKN | ADSP-1081ATD | ADSP-1081AJD | ADSP-1081AKD | |
|---|---|---|---|---|---|---|
| Description | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, PDIP40, PLASTIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 | 8-BIT, DSP-MULTIPLIER, CDIP40, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-40 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
| Contacts | 40 | 40 | 40 | 40 | 40 | 40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow |
| boundary scan | NO | NO | NO | NO | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | R-CDIP-T40 | R-CDIP-T40 | R-PDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| low power mode | NO | NO | NO | NO | NO | NO |
| Humidity sensitivity level | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| Output data bus width | 16 | 16 | 16 | 16 | 16 | 16 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Maximum seat height | 4.29 mm | 4.29 mm | 5.08 mm | 4.29 mm | 4.29 mm | 4.29 mm |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER |
| length | 50.8 mm | 50.8 mm | - | 50.8 mm | 50.8 mm | 50.8 mm |
| Maker | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
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