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R71PF2330500-M

Description
CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 630 V, 0.033 uF, THROUGH HOLE MOUNT, RADIAL LEADED
CategoryPassive components    capacitor   
File Size490KB,5 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

R71PF2330500-M Overview

CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 630 V, 0.033 uF, THROUGH HOLE MOUNT, RADIAL LEADED

R71PF2330500-M Parametric

Parameter NameAttribute value
MakerKEMET
package instruction,
Reach Compliance Codecompli
Other featuresRATED AC VOLTAGE (V): 275
capacitance0.033 µF
Capacitor typeFILM CAPACITOR
dielectric materialsPOLYPROPYLENE
JESD-609 codee3
Manufacturer's serial numberR71
Installation featuresTHROUGH HOLE MOUNT
negative tolerance20%
Maximum operating temperature110 °C
Minimum operating temperature-40 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
positive tolerance20%
Rated (DC) voltage (URdc)630 V
surface mountNO
Terminal surfaceTIN
Terminal shapeWIRE
Loose
Fig.1
Taped
Fig.2
metalliZeD PolyProPylene film
CaPaCitor
PRODUCT CODE:
r71
Pitch Boxthickness(B)
(mm)
(mm)
10.0
All
15.0
<7.5
15.0
≥7.5
22.5
All
27.5
All
37.5
All
MKPSeries
r71
typical applications:
P.F.C. (Power Factor Correction)
Ød±0.05
p≤15
0.6or0.8*
22.5≤ p≤ 27.5
0.8
p=37.5
1
*Seesizetable.
Alldimensionsareinmm.
mKP Series
General teChniCal Data
Dielectric:
polypropylene film.
Plates:

metallayerdepositedbyevaporationunder

vacuum.
Winding:
 non-inductivetype.
leads:
tinned wire.
Protection:
plastic case, thermosetting resin filled.
box material is solvent resistant and flame

retardantaccordingtoUL94V0.
marking:
Manufacturer’slogo,series,capacitance,

tolerance,D.C.ratedvoltage.
operating temperature range:
-40 to +110°C
For temperatures between +105°C and 110°C a
 decreasingfactorof4%perdegreeContherated
 voltageV
R
hastobeapplied.
eleCtriCal CharaCteriStiCS
0.01
µ
Fto22
µ
F
(measuredat1kHz):
±10%
(K);
±20%
(M);
Tolerance±5%(J)available
upon requests
total self-inductance(L):
(leadlength~2mm)
Capacitance range:
Capacitance tolerances


Pitch(mm)
L(nH)≈
10
9
15
10
22.5
18
27.5
18
37.5
20
Maximumdimensions(mm)
Bmax
Hmax
Lmax
b +0.2
H +0.1
L +0.2
b +0.2
H +0.1
L +0.3
b +0.2
H +0.1
L +0.5
b +0.2
H +0.1
L +0.3
b +0.2
H +0.1
L +0.3
b +0.3
H +0.1
L +0.3
teSt methoD anD PerformanCe
Damp heat, steady state:
test conditions 1st
Temperature:
Relative humidity (RH):
Test duration:
test conditions 2nd
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitancechange|∆C/C|:
Insulation resistance:
endurance:
test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitancechange|∆C/C|:
Insulation resistance:
resistance to soldering heat:
test conditions
Solder bath temperature:
Dipping time (with heat screen):
Performance
Capacitancechange|∆C/C|:
≤2%
+260°C±5°C
10 s±1s
≤5%
≥50%ofinitiallimit.
+60°C±2°C
95%
±2%
500 hours
+40°C±2°C
93%
±2%
56 days
+105°C±2°C
2000 h
1.25xV
R
≤5%
≥50%ofinitiallimit.
Dissipation factor (Df):
tgδx10
-4
at +25°C
±5°C:
≤10(6)*at1kHz

*Typicalvalue
insulation resistance:
test conditions
Temperature:
+25°C±5°C
Voltage charge time:
1 min
Voltage charge:
100 Vdc
Performance
≥1x10
5
MΩ for C
≤0.33
µ
F (5x10
5
MΩ)*

≥30000s
for C
>0.33
µ
F  (150000s)*
*Typicalvalue
test voltage between terminations:
1.6xV
R
applied for 2 s at +25°C±5°C
Winding scheme
singlesidedmetallized
polypropylene film
05/2007

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