Standard SRAM, 128KX8, 100ns, CMOS, PBGA36, MINI, BGA-36
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Integrated Silicon Solution ( ISSI ) |
Parts packaging code | BGA |
package instruction | MINI, BGA-36 |
Contacts | 36 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Maximum access time | 100 ns |
JESD-30 code | R-PBGA-B36 |
JESD-609 code | e0 |
memory density | 1048576 bi |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 36 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |