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HM23C1002M-20

Description
MASK ROM, 128KX8, 200ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32
Categorystorage    storage   
File Size311KB,7 Pages
ManufacturerHualon Microelectronics Corp
Download Datasheet Parametric Compare View All

HM23C1002M-20 Overview

MASK ROM, 128KX8, 200ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32

HM23C1002M-20 Parametric

Parameter NameAttribute value
MakerHualon Microelectronics Corp
Parts packaging codeSOIC
package instructionSOP,
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time200 ns
JESD-30 codeR-PDSO-G32
memory density1048576 bi
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal locationDUAL

HM23C1002M-20 Related Products

HM23C1002M-20 HM23C1002AM-15 HM23C1002M-15 HM23C1002AM-20 HM23C1002AP-15 HM23C1002P-15
Description MASK ROM, 128KX8, 200ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 MASK ROM, 128KX8, 200ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Maker Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp
Parts packaging code SOIC SOIC SOIC SOIC DIP DIP
package instruction SOP, SOP, SOP, SOP, DIP, DIP,
Contacts 32 32 32 32 32 32
Reach Compliance Code unknow unknow unknow unknow unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 200 ns 150 ns 150 ns 200 ns 150 ns 150 ns
JESD-30 code R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32 R-PDIP-T32
memory density 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bi
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP SOP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
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