HM23C1002AP-15 datasheet, PDF - EEWORLD Datasheet

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HM23C1002AP-15: DescriptionMASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32; Categorystorage storage; File Size311KB，7 Pages; ManufacturerHualon Microelectronics Corp

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HM23C1002AP-15 Overview

MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

HM23C1002AP-15 Parametric

Parameter Name	Attribute value
Maker	Hualon Microelectronics Corp
Parts packaging code	DIP
package instruction	DIP,
Contacts	32
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	150 ns
Other features	AUTOMATIC POWER-DOWN
JESD-30 code	R-PDIP-T32
memory density	1048576 bi
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal location	DUAL

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HM23C1002AP-15 Related Products

	HM23C1002AP-15	HM23C1002AM-15	HM23C1002M-15	HM23C1002AM-20	HM23C1002M-20	HM23C1002P-15
Description	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 200ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 200ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Maker	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp
Parts packaging code	DIP	SOIC	SOIC	SOIC	SOIC	DIP
package instruction	DIP,	SOP,	SOP,	SOP,	SOP,	DIP,
Contacts	32	32	32	32	32	32
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	150 ns	150 ns	200 ns	200 ns	150 ns
JESD-30 code	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32
memory density	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	SOP	SOP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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