|
72520L80J |
72520L40J |
Description |
Bi-Directional FIFO, 1KX18, 80ns, Synchronous, CMOS, PQCC52 |
Bi-Directional FIFO, 1KX18, 40ns, Synchronous, CMOS, PQCC52 |
Is it lead-free? |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
package instruction |
QCCJ, LDCC52,.8SQ |
QCCJ, LDCC52,.8SQ |
Reach Compliance Code |
_compli |
not_compliant |
ECCN code |
EAR99 |
EAR99 |
Maximum access time |
80 ns |
40 ns |
JESD-30 code |
S-PQCC-J52 |
S-PQCC-J52 |
JESD-609 code |
e0 |
e0 |
memory density |
18432 bi |
18432 bit |
Memory IC Type |
BI-DIRECTIONAL FIFO |
BI-DIRECTIONAL FIFO |
memory width |
18 |
18 |
Humidity sensitivity level |
1 |
1 |
Number of terminals |
52 |
52 |
word count |
1024 words |
1024 words |
character code |
1000 |
1000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
organize |
1KX18 |
1KX18 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
QCCJ |
QCCJ |
Encapsulate equivalent code |
LDCC52,.8SQ |
LDCC52,.8SQ |
Package shape |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER |
CHIP CARRIER |
Peak Reflow Temperature (Celsius) |
225 |
225 |
power supply |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum standby current |
0.03 A |
0.03 A |
Maximum slew rate |
0.22 mA |
0.22 mA |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Terminal form |
J BEND |
J BEND |
Terminal pitch |
1.27 mm |
1.27 mm |
Terminal location |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
30 |
30 |