72520L40J datasheet, PDF - EEWORLD Datasheet

72520L40J: DescriptionBi-Directional FIFO, 1KX18, 40ns, Synchronous, CMOS, PQCC52; Categorystorage storage; File Size2MB，29 Pages; ManufacturerIDT (Integrated Device Technology)

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72520L40J Overview

Bi-Directional FIFO, 1KX18, 40ns, Synchronous, CMOS, PQCC52

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
package instruction	QCCJ, LDCC52,.8SQ
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	40 ns
JESD-30 code	S-PQCC-J52
JESD-609 code	e0
memory density	18432 bit
Memory IC Type	BI-DIRECTIONAL FIFO
memory width	18
Humidity sensitivity level	1
Number of terminals	52
word count	1024 words
character code	1000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1KX18
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.03 A
Maximum slew rate	0.22 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
Base Number Matches	1

	72520L40J	72520L80J
Description	Bi-Directional FIFO, 1KX18, 40ns, Synchronous, CMOS, PQCC52	Bi-Directional FIFO, 1KX18, 80ns, Synchronous, CMOS, PQCC52
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
package instruction	QCCJ, LDCC52,.8SQ	QCCJ, LDCC52,.8SQ
Reach Compliance Code	not_compliant	_compli
ECCN code	EAR99	EAR99
Maximum access time	40 ns	80 ns
JESD-30 code	S-PQCC-J52	S-PQCC-J52
JESD-609 code	e0	e0
memory density	18432 bit	18432 bi
Memory IC Type	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO
memory width	18	18
Humidity sensitivity level	1	1
Number of terminals	52	52
word count	1024 words	1024 words
character code	1000	1000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	1KX18	1KX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ	LDCC52,.8SQ
Package shape	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER
Peak Reflow Temperature (Celsius)	225	225
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum standby current	0.03 A	0.03 A
Maximum slew rate	0.22 mA	0.22 mA
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
Terminal form	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	30	30

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