223878055551 datasheet, PDF - EEWORLD Datasheet

223878055551: DescriptionCeramic Capacitor, Multilayer, Ceramic, 16V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.12uF, Surface Mount, 0805, CHIP; CategoryPassive components capacitor; File Size365KB，25 Pages; ManufacturerYAGEO; Websitehttp://www.yageo.com/; Environmental Compliance

Download Datasheet Parametric View All

223878055551 Overview

Ceramic Capacitor, Multilayer, Ceramic, 16V, 5% +Tol, 5% -Tol, X7R, 15% TC, 0.12uF, Surface Mount, 0805, CHIP

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	YAGEO
package instruction	, 0805
Reach Compliance Code	compli
ECCN code	EAR99
capacitance	0.12 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.85 mm
JESD-609 code	e3
length	2 mm
Manufacturer's serial number	X7R
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, PAPER, 13 INCH
positive tolerance	5%
Rated (DC) voltage (URdc)	16 V
series	2238 78(0805,0.85T)
size code	0805
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrie
Terminal shape	WRAPAROUND
width	1.25 mm

DATA SHEET

SURFACE-MOUNT CERAMIC

MULTILAYER CAPACITORS

Class 2, X7R

V TO

500

Product Specification – Aug 17, 2005 V.9

FPGA design ideas and techniques: data interface synchronization: ...; 至芯科技FPGA大牛 FPGA/CPLD

It is said that uC/OS system is free. Is it true?: According to a friend, uC/OS system has seen a sharp drop in product purchase rate due to the impact of open source systems such as freeRTOS, so it decided not to charge for it and go the open source ...; bigbat Embedded System

Last two days! Free review - Pingtouge scenario-based Bluetooth Mesh gateway development kit: Board Introduction Model: Scenario-based Bluetooth Mesh Gateway Development Kit (including 1 central device development board and 2 Bluetooth node development boards ) From: Flathead Quantity: 3 setsT...; okhxyyo RF/Wirelessly

EEWORLD University Hall----Research and development of high-speed motors: Research and development of high-speed motors : https://training.eeworld.com.cn/course/4803Discusses the current status and prospects of high-speed motor research and development...; JFET Industrial Control Electronics

How to choose between different chips in TI's Sub-1GHz product line?: New product designs recommend the use of high-performance transceiver series, including CC1120, CC1125, CC1200. Both CC1120 and CC1125 support narrowband applications, and their corresponding RF perfo...; Jacktang Wireless Connectivity

Why does C6000 need Cache?: Large-capacity memory (such as DRAM) has limited access speed, which is generally much slower than the CPU clock speed; small-capacity memory (such as SRAM) can provide fast access speed. Therefore, m...; fish001 DSP and ARM Processors

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components