SRAM Module, 2MX8, 120ns, CMOS, CPGA66, 1.380 X 1.380 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Parameter Name | Attribute value |
Maker | White Electronic Designs Corporation |
package instruction | 1.380 X 1.380 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
Reach Compliance Code | unknow |
Maximum access time | 120 ns |
Other features | USER CONFIGURABLE AS 512K X 32 |
Spare memory width | 16 |
JESD-30 code | S-CPGA-P66 |
length | 35 mm |
memory density | 16777216 bi |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 66 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 2MX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 5.9 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
width | 35 mm |