Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | White Electronic Designs Corporation |
package instruction | BGA, BGA219,16X16,50 |
Reach Compliance Code | unknow |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 5.4 ns |
Other features | AUTO/SELF REFRESH |
Spare memory width | 32 |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
JESD-30 code | R-PBGA-B219 |
length | 32 mm |
memory density | 1073741824 bi |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 64 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 219 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 16MX64 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA219,16X16,50 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 8192 |
Maximum seat height | 2.2 mm |
self refresh | YES |
Maximum standby current | 0.24 A |
Maximum slew rate | 0.75 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 25 mm |
WEDPN16M64VR-133BI | WEDPN16M64VR-100BC | WEDPN16M64VR-125BM | WEDPN16M64VR-125BI | WEDPN16M64VR-125BC | WEDPN16M64VR-100BI | WEDPN16M64VR-66BI | WEDPN16M64VR-66BM | WEDPN16M64VR-133BC | WEDPN16M64VR-100BM | |
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Description | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 5.8ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 5.8ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 5.8ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |
package instruction | BGA, BGA219,16X16,50 | BGA, BGA219,16X16,50 | 32 X 25 MM, PLASTIC, BGA-219 | BGA, BGA219,16X16,50 | BGA, BGA219,16X16,50 | BGA, BGA219,16X16,50 | BGA, BGA219,16X16,50 | 32 X 25 MM, PLASTIC, BGA-219 | BGA, BGA219,16X16,50 | 32 X 25 MM, PLASTIC, BGA-219 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknown |
access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
Maximum access time | 5.4 ns | 6 ns | 5.8 ns | 5.8 ns | 5.8 ns | 6 ns | 7.5 ns | 7.5 ns | 5.4 ns | 6 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO REFRESH | AUTO/SELF REFRESH | AUTO REFRESH |
Spare memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Maximum clock frequency (fCLK) | 133 MHz | 100 MHz | 125 MHz | 125 MHz | 125 MHz | 100 MHz | 66 MHz | 66 MHz | 133 MHz | 100 MHz |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 | R-PBGA-B219 |
length | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm |
memory density | 1073741824 bi | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bi | 1073741824 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 219 | 219 | 219 | 219 | 219 | 219 | 219 | 219 | 219 | 219 |
word count | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
character code | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 125 °C | 85 °C | 70 °C | 85 °C | 85 °C | 125 °C | 70 °C | 125 °C |
Minimum operating temperature | -40 °C | - | -55 °C | -40 °C | - | -40 °C | -40 °C | -55 °C | - | -55 °C |
organize | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 | 16MX64 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
Encapsulate equivalent code | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 | BGA219,16X16,50 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
Maximum seat height | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm |
Maximum standby current | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A | 0.24 A |
Maximum slew rate | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA | 0.75 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | MILITARY | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | COMMERCIAL | MILITARY |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm |
self refresh | YES | YES | - | YES | YES | YES | YES | - | YES | - |