Flash Module, 2MX64, 100ns, PBGA119, STACKED TSOP, BGA-119
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | White Electronic Designs Corporation |
| package instruction | STACKED TSOP, BGA-119 |
| Reach Compliance Code | unknow |
| Maximum access time | 100 ns |
| Other features | ALSO CONFIGURABLE AS 8M X 16 OR 16M X 8 |
| Spare memory width | 32 |
| startup block | BOTTOM |
| JESD-30 code | S-PBGA-B119 |
| memory density | 134217728 bi |
| Memory IC Type | FLASH MODULE |
| memory width | 64 |
| Number of functions | 1 |
| Number of terminals | 119 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2MX64 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Programming voltage | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 7.56 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| type | NOR TYPE |
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