When other solvents are used, package resin may be penetrated by
solvents. Please confirm under actual conditions before use.
2
Notice
Internet
;
;;
;;
;;
;
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://sharp-world.com/ecg/
;
;
;;
;;
;;
;;
;;
General Description of Light Emitting Diodes
General Description
General LED Characteristics
(1) Absolute maximum ratings
Conditions which should never be exceeded to prevent
destruction of the LED and which correlate with the
operating temperature.
(2) Continuous forward current (I
F
), peak forward
current (I
FM
)
Current which causes the LED to emit light. Since the LED
generates a certain amount of heat as current flows which
affects the operating life, the current is limitted by a forward
current derating curve.
(3) Reverse voltage (V
R
)
An LED is a diode designed for its light emitting
characteristics. Unlike ordinary diodes, the reverse voltage
cannot be controlled by changing the concentration of the
PN junction. Therefore, if a 3 V or higher reverse bias is
applied, the addition of a protective circuit is recommended.
(4) Power dissipation (P)
The internal power dissipation of the LED. The life of the
LED lengthens if it is used at a dissipation (junction
temperature) below a certain level (temperature) .
(5) Operating temperature (T
opr
)
Refers to the temperature range including the heat generated
by the device during operation of the LED. Operation under
conditions where damage to the package material does not
occur is recommended.
(6) Storage temperature (T
stg
)
Refers to the temperature range during non-operation of the
LED. Since it is important for the LED package to pass
light, it is not possible to change the content of the filler
material to improve the temperature characteristics like for
IC packages.
(7) Forward voltage (V
F
)
The voltage between electrodes when forward current is
applied to the LED. It differs according to the added
impurities in the crystal material.
(8) Reverse current (I
R
)
The current when reverse voltage is applied. It is
sufficiently small compared to the forward current. It is
recommended that a circuit which applies a reverse bias
should be avoided.
(9) Luminous intensity (I
V
)
Refers to the brightness measured at a distance of one feet
from the light source. Common units are the µcd and mcd.
The magnitude of the numeric value and the apparent
brightness do not necessary correspond. In actuality, it is
necessary to take into account the contrast, luminance and
These characteristics differ according to the crystal material
and added impurities.
(11)Directive characteristics, Half value of viewing
angle
Represents the directivity dependency of the LED luminous
intensity as a relative luminous intensity value. Generally,
the luminous intensity is highest along the normal optical
axis and decreases as the angle with respect to the optical
axis increases. The angle at which the luminous intensity
drops to 50% of the peak value is called the halfpower
angle. It can be used as a guide showing the sharpness of the
directivity.
Notice
Internet
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://sharp-world.com/ecg/
3
Numbering System
New numbering system
GL
Serial No.
wRadiation
color
qRadiation
shape
LED Large Lamp
GL
Rank
Radiation
Radiation
shape Radiation characteristics Lead type
Lens type
Taping type
color
LT95
Serial No.
wRadiation
color
qRadiation
shape
2 ----- ø2
3 ----- ø3
4 ----- ø4
5/6 --- ø5
7 ----- ø7.5
8 ----- Specific appearance
(Arch, Rectangle,
Square, Triangle)
0 ----- ø10
wRadiation
color
ISingle
color type
Series
B
KG, K
EG, E, C
*
HY, H
HS, S
HD, D
TR, T
UR, U
PR, P
ZG
ZE
ZV
ZS
XS
ZJ
ZR
JV
JS
JJ
JR
GT, GC
BT, BC
Emitting color
Blue
Green
Yellow-green
Yellow
Sunset orange
Red
Red(High-luminosity)
Red(Super-luminosity)
Red
Green(Super-luminosity)
Yellow-green(Super-luminosity)
Amber(Super-luminosity)
Sunset orange(Super-luminosity)
Sunset orange(Super-luminosity)
Orange(Super-luminosity)
Red(Super-luminosity)
Amber(High-luminosity)
Sunset orange(High-luminosity)
Orange(High-luminosity)
Red(High-luminosity)
Green(Super-luminosity)
Blue(Super-luminosity)
IDichromatic
type
Series
KS
EH
ED
ET
CU
*1
EP
HP
Emitting color
GreenK+Sunset orangeS
Yellow-greenE+YellowH
Yellow-greenE+RedD
Yellow-greenE+Red(High-luminosity)T
Yellow-greenC+Red(Super-luminosity)U
Yellow-greenE+RedP
YellowH+RedP
*1 CU series : Anode common
*1 It is able to simplify the operation circuit due to Anode common
connection.
(Circuit example)
V
2
V
1
+5V
Yellow-green
Red
V
1
5V
V
1
5V
Yellow-green
Red
Dotted line portion
becomes useless.
LED driver
5V
0V
LED driver
5V
0V
*C: Inversion type of EG
Note)Sharp can supply LED lamps with tie-bar. If necessary, please
make contact to Sharp.
Ratings, electro-optical characteristics are shown on the page 96 to 104.
* LED is represented by the symbol below(JISC0301).
4
Notice
Internet
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://sharp-world.com/ecg/
LED Lamp
GL3❏❏8 series
GL3❏❏8 series
I
Outline Dimensions
Colored diffusion
Protruded resin 0.8MAX
ø3.8
ø3.0
-30˚
-40˚
ø3mm(T-1), Cylinder Type,
Colored Diffusion LED
Lamps for Indicator
(Unit : mm)
I
Directive Characteristics
(T
a
=25˚C)
-20˚
-10˚
0˚ 100 +10˚
+20˚
+30˚
+40˚
4.4
5.0
Relative luminous intensity(%)
80
+50˚
60
10.4
±0.5
-50˚
0.25
+0.5
-0.25
(Tie-bar cut)
(1.0)
-60˚
+60˚
40
+70˚
20
25.0MIN
0.5
±0.1
-70˚
-80˚
+80˚
-90˚
0
+90˚
0.5
±0.1
1.7
2.54NOM
1
2
(Dimension from the center of ø3mm)
(1.0)
Pin connections
1
Anode
2
Cathode
Unspecified tolerance:±0.2
I
Absolute Maximum Ratings
Model No. Emitting color
Material
Power dissipation Forward current Peak forward current
P
I
F
I
FM*1
(mW)
(mA)
(mA)
(T
a
=25˚C)
Derating factor Reverse voltage Operating temperature Storage temperature Soldering temperature
(mA/˚C)
V
R
T
opr
T
stg
T
sol*2
(V)
(˚C)
(˚C)
(˚C)
DC Pulse
0.67
0.67
0.67
0.67
0.67
0.67
5
5
5
5
5
5
-25 to +85
-25 to +85
-25 to +85
-25 to +85
-25 to +85
-25 to +85
-25 to +100
-25 to +100
-25 to +100
-25 to +100
-25 to +100
-25 to +100
260
260
260
260
260
260
GaP
23
10
50
0.13
GL3PR8
Red
GaAsP on GaP
84
30
50
0.40
GL3HD8
Red
84
30
50
0.40
GL3HS8
Sunset orange GaAsP on GaP
GaAsP on GaP
84
30
50
0.40
GL3HY8
Yellow
84
30
50
0.40
GL3EG8
Yellow-green GaP
GaP
84
30
50
0.40
GL3KG8
Green
*1 Duty ratio=1/10, Pulse width=0.1ms
*2 5s or less(At the position of 1.6mm or more from the bottom face of resin package)
I
Electro-optical Characteristics
Lens type
Model No.
Forward voltage
V
F
(V)
TYP
1.9
2.0
2.0
2.0
2.1
2.1
MAX
2.3
2.8
2.8
2.8
2.8
2.8
Peak emission wavelength
I
F
λ
p
(nm)
(mA)
TYP
695
635
610
585
565
555
5
20
20
20
20
20
Luminous intensity
I
F
I
V
(mcd)
(mA)
TYP
8.0
40
60
55
60
30
5
20
20
20
20
20
Spectrum radiation bandwidth
I
F
∆λ(nm)
(mA)
TYP
100
35
35
30
30
25
5
20
20
20
20
20
Reverse current
I
R
(µA)
MAX
10
10
10
10
10
10
V
R
(V)
4
4
4
4
4
4
Terminal capacitance
C
t
(pF)
TYP
55
20
15
35
35
40
(T
a
=25˚C)
Page for
characteristics
(MH
Z
)
diagrams
1
1
1
1
1
1
100
101
101
102
102
103
GL3PR8
GL3HD8
Colored
GL3HS8
diffusion
GL3HY8
GL3EG8
GL3KG8
42
Notice
Internet
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://sharp-world.com/ecg/
Characteristics Diagrams
ZR series
Forward Current Derating Curve
60
Forward Current vs. Forward Voltage(Note)
100
50
(T
a=
25˚C)
Luminous Intensity vs. Ambient Temperature(Note)
1000
500
(1
F
=20mA)
50
Relative luminous intensity(%)
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Forward current I
F
(mA)
40
Forward current I
F
(mA)
10
5.0
100
50
30
20
1.0
0.5
10
5.0
10
0
-40
0
25
50
75 85
100
125
0.1
1.0
1.0
-40
-20
0
20
40
60
80
100
Forward voltage V
F
(V)
Ambient temperature T
a(
˚C)
Ambient temperature T
a
(˚C)
Peak Forward Current Derating Curve
120
Luminous Intensity vs. Forward Current(Note)
1000
500
(T
a=
25˚C)
Duty Ratio vs. Peak Forward Current
(T
a=
25˚C)
500
200
Peak forward current I
FM
(mA)
100
50
100
Relative luminous intensity(%)
200
100
50
Peak forward current I
FM
(mA)
80
60
20
10
5.0
2.0
20
10
5.0
2.0
1.0
40
20
0
-40
0
25
50
75 85
100
125
1.0
0.1
0.2
0.5
1
2
5
10
20
50
1/50
1/20
1/10
1/5
1/2
1
Ambient temperature T
a
(˚C)
Forward current I
F
(mA)
Duty ratio D
R
ZJ series
Forward Current Derating Curve
60
Forward Current vs. Forward Voltage(Note)
100
50
(T
a=
25˚C)
Luminous Intensity vs. Ambient Temperature(Note)
1000
500
(1
F
=20mA)
50
Relative luminous intensity(%)
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Forward current I
F
(mA)
Forward current I
F
(mA)
40
10
5.0
100
50
30
20
1.0
0.5
10
5.0
10
0
-40
0
25
50
75 85
00
125
0.1
1.0
1.0
-40
-20
0
20
40
60
80
100
Forward voltage V
F
(V)
Ambient temperature T
a
(˚C)
Ambient temperature T
a
(˚C)
Peak Forward Current Derating Curve
120
Luminous Intensity vs. Forward Current(Note)
1000
500
(T
a=
25˚C)
Duty Ratio vs. Peak Forward Current
(T
a=
25˚C)
500
200
Peak forward current I
FM
(mA)
100
50
100
Relative luminous intensity(%)
200
100
50
Peak forward current I
FM
(mA)
80
60
20
10
5.0
20
10
5.0
2.0
1.0
40
20
2.0
0
-40
0
25
50
75 85
100
125
1.0
0.1
0.2
0.5
1
2
5
10
20
50
1/50
1/20
1/10
1/5
1/2
1
Ambient temperature T
a
(˚C)
Forward current I
F
(mA)
Duty ratio D
R
Note)Characteristics shown in diagrams are typical values. (not assurance value)
96
Notice
Internet
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://sharp-world.com/ecg/
Open a book in the boundless spring; open a book in the hot summer while staying in an air-conditioned room; open a book while sitting in a corner of the park in the rustling autumn breeze; open a boo...
What I shared is a PPT. I sorted out the pictures I tested myself and shared them with you. Of course, they are very accurate pictures. They are very enjoyable to watch.Recommended collection! Electro...
[size=4][color=#000000][backcolor=white]1. In the previous example, we used the virtual terminal in proteus to realize the function of the microcontroller sending strings to the host through the seria...
I used ADS1220 to collect the sensor force value and did some filtering, but the force value still jittered a lot.I took the average of 32 points and used a de-jitter filter, but it didn't work.
The c...
We often see articles about PC MODEM communication, but articles about MCU MODEM communication are rare. Now I will write down my personal experience of MCU MODEM communication for your reference...[Details]
Functional indicators
Compact, Low Cost, 5 V, Variable Gain Inverting Amplifier Using the AD5270/AD5272 Digital Rheostat and the AD8615 Op Amp
Circuit Description
The circuit ...[Details]
Abstract: In order to improve the safety of reversing, a vehicle electronic rearview mirror system based on SOPC technology is proposed. The system has the functions of rearview camera, dual-frequ...[Details]
Detailed explanation of the ground wire problem of the oscilloscope. When the signal generator is used to input the signal to the board, the oscilloscope can generally only be used to test the wavefo...[Details]
According to South Korea’s News1 news website on September 8, due to overcapacity of Chinese competitors, South Korean manufacturers such as LG and Samsung will implement "human resource structure ad...[Details]
When humans face major natural disasters, accidents, and public health emergencies, emergency communication support is indispensable. There is a company that combines drones with small communicatio...[Details]
On November 22, 2019, Intel China released its 2018-2019 Corporate Social Responsibility Report. Intel China has proactively released this transparent annual report every year since 2009, which ...[Details]
With the development of social life, people's requirements for current printing and dyeing products are getting higher and higher, especially for cloth and packaging shells, so the requirements f...[Details]
The correct way to ground the inverter is as follows:
1. The grounding point of the inverter must be separated from the grounding point of the power equipment and cannot share the same ground ...[Details]
When I was learning C language before, I felt that it was hell when arrays and pointers were combined. It was easy to get confused. Recently, I read the in-depth analysis of C language and got a littl...[Details]
Among the current defense measures against the spread of thermal runaway, the core is still to discuss cost-effectiveness, at the module and pack levels. The former costs more and requires many measu...[Details]
1 Introduction
In recent years, due to the rapid development of wireless networks, the increase in speed and the decrease in prices, many users have begun to use wireless networks. Wireless n...[Details]
PIC microcontroller is a device that people who study microcontrollers must come into contact with, so everyone has a certain understanding of PIC microcontrollers. In the process of learning PIC mic...[Details]
If you crash a Tesla, the manufacturer will say it can't be repaired, and outsiders will say they don't have the technology to repair it, so the car can only be scrapped. But an American electrical e...[Details]
1. Download uboot.bin to the development board through the U disk. The U disk must be burned into the U disk with a quick burning tool in the Feiling CD in advance, but this file cannot be seen aft...[Details]
Talking
京公网安备 11010802033920号
EEWORLD
