EEWORLDEEWORLDEEWORLD

Part Number

Search

MCM62L07CJ35

Description
256KX1 STANDARD SRAM, 35ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24
Categorystorage    storage   
File Size161KB,7 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MCM62L07CJ35 Overview

256KX1 STANDARD SRAM, 35ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24

MCM62L07CJ35 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
Parts packaging codeSOJ
package instructionSOJ, SOJ24,.34
Contacts24
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time35 ns
I/O typeSEPARATE
JESD-30 codeR-PDSO-J24
JESD-609 codee0
length15.875 mm
memory density262144 bi
Memory IC TypeSTANDARD SRAM
memory width1
Number of functions1
Number of ports1
Number of terminals24
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX1
Output characteristics3-STATE
ExportableNO
Package body materialPLASTIC/EPOXY
encapsulated codeSOJ
Encapsulate equivalent codeSOJ24,.34
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height3.75 mm
Maximum standby current0.00005 A
Minimum standby current2 V
Maximum slew rate0.11 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

MCM62L07CJ35 Related Products

MCM62L07CJ35 MCM62L07CJ25 MCM62L07CJ25R2 MCM62L07CJ20R2 MCM62L07CJ20 MCM62L07CJ35R2
Description 256KX1 STANDARD SRAM, 35ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 256KX1 STANDARD SRAM, 25ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 256KX1 STANDARD SRAM, 25ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 256KX1 STANDARD SRAM, 20ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 256KX1 STANDARD SRAM, 20ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 256KX1 STANDARD SRAM, 35ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-24
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOJ SOJ SOJ SOJ SOJ SOJ
package instruction SOJ, SOJ24,.34 SOJ, SOJ24,.34 SOJ, SOJ24,.34 SOJ, SOJ24,.34 SOJ, SOJ24,.34 SOJ, SOJ24,.34
Contacts 24 24 24 24 24 24
Reach Compliance Code unknow unknown unknown unknown unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 35 ns 25 ns 25 ns 20 ns 20 ns 35 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-PDSO-J24 R-PDSO-J24 R-PDSO-J24 R-PDSO-J24 R-PDSO-J24 R-PDSO-J24
JESD-609 code e0 e0 e0 e0 e0 e0
length 15.875 mm 15.875 mm 15.875 mm 15.875 mm 15.875 mm 15.875 mm
memory density 262144 bi 262144 bit 262144 bit 262144 bit 262144 bi 262144 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 24 24 24 24 24 24
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX1 256KX1 256KX1 256KX1 256KX1 256KX1
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable NO NO NO NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOJ SOJ SOJ SOJ SOJ SOJ
Encapsulate equivalent code SOJ24,.34 SOJ24,.34 SOJ24,.34 SOJ24,.34 SOJ24,.34 SOJ24,.34
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.75 mm 3.75 mm 3.75 mm 3.75 mm 3.75 mm 3.75 mm
Maximum standby current 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A
Minimum standby current 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.11 mA 0.12 mA 0.12 mA 0.12 mA 0.12 mA 0.11 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND J BEND J BEND J BEND J BEND J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm
Maker Motorola ( NXP ) - - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
The era of distributed edge computing is coming? What do you think about this?
I saw an article today. The theme is that the era of distributed edge computing has arrived. What do you think about this? Do you think it has arrived? What changes will it bring to us? ?I moved the c...
okhxyyo Embedded System
5G commonly used terms, too comprehensive.
Are you still worried about the common 5G terms? Today I will share some common terms.eCPRI (Enhanced Common Public Radio Interface) is a fronthaul interface protocol used to connect wireless base sta...
alan000345 RF/Wirelessly
[Teardown] What is the resolution of 20 million pixels? Do you really understand digital microscopes?
I recently had to disassemble a digital microscope. I had received it for a long time but I didn't disassemble it because I encountered a little trouble. At first, I received a 20-megapixel digital di...
littleshrimp Integrated technical exchanges
LPS27HHTW MEMS Pressure Sensor
The LPS27HHTW MEMS pressure sensor is an ultra-compact piezoresistive absolute pressure sensor that can be used as a digital output barometer. The LPS27HHTW sensor also embeds a temperature sensor for...
littleshrimp MEMS sensors
Are lead-free HASL and lead-free solder the same thing?
Are lead-free HASL and lead-free solder the same thing? Are lead-free or lead-free surface treatment the same thing as lead-free or lead-free solder paste used in soldering?...
小太阳yy PCB Design
CC2640R2F ADC
Now I provide an ADC subroutine that I wrote myself, which has been verified by many people and can be used.The subroutine is as follows: #include "AppAdc.h" #include inc/hw_types.h #include ti/sysbio...
Jacktang Wireless Connectivity

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号