Microprocessor Circuit, CMOS, BGA
Parameter Name | Attribute value |
Maker | AMD |
package instruction | BGA, |
Reach Compliance Code | compli |
Factory Lead Time | 16 weeks |
JESD-30 code | S-PBGA-B |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
surface mount | YES |
technology | CMOS |
Terminal form | BALL |
Terminal location | BOTTOM |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT |
GE217GIBJ23HM | GE210HICJ23HM | |
---|---|---|
Description | Microprocessor Circuit, CMOS, BGA | Microprocessor Circuit, CMOS, BGA |
Maker | AMD | AMD |
package instruction | BGA, | BGA, |
Reach Compliance Code | compli | compli |
JESD-30 code | S-PBGA-B | S-PBGA-B |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA |
Package shape | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY |
surface mount | YES | YES |
technology | CMOS | CMOS |
Terminal form | BALL | BALL |
Terminal location | BOTTOM | BOTTOM |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |