PART NUMBER:
± 2g Tri-axis Digital Accelerometer
Specifications
KXSD9-2050
Rev. 3
Jul-2010
Product Description
The KXSD9 is a tri-axis silicon micromachined accelerometer with
a user selectable full-scale output range of ±2g, ±4g, ±6g or ±8g.
The sense element is fabricated using Kionix’s proprietary plasma
micromachining process technology. Acceleration sensing is based
on the principle of a differential capacitance arising from
acceleration-induced motion of the sense element, which further
utilizes common mode cancellation to decrease errors from
process variation, temperature, and environmental stress. The
sense element is hermetically sealed at the wafer level by bonding
a second silicon lid wafer to the device using a glass frit. A
separate ASIC device packaged with the sense element provides
signal conditioning, self-test, and temperature compensation. The
accelerometer is delivered in a 3 x 3 x 0.9 mm LGA plastic package
operating from a 1.8 – 3.6V DC supply. Either I
2
C or SPI interfaces can be used to communicate to
the chip to trigger A/D conversions or manage power consumption.
Functional Diagram
X
Sensor
Y
Sensor
Charge
Amp
LPF
Z
Sensor
Vdd
5
IO Vdd
1
GND
4
6
Temp
Sensor
A/D
SPI/I C
Motion Detection
8
9
10
7
2
3
AUX IN
36 Thornwood Dr. – Ithaca, NY 14850
tel: 607-257-1080 – fax:607-257-1146
www.kionix.com -
info@kionix.com
© 2009 Kionix – All Rights Reserved
310-1547-1007221647
Page 1 of 25
PART NUMBER:
± 2g Tri-axis Digital Accelerometer
Specifications
KXSD9-2050
Rev. 3
Jul-2010
Product Specifications
Table 1. Mechanical
(specifications are for operation at 3.3V and T = 25C unless stated otherwise)
Parameters
Operating Temperature Range
Zero-g Offset
Zero-g Offset Variation from RT over Temp.
FS1=1, FS0=1 (± 2g)
Sensitivity
1
Units
ºC
counts
mg/ºC
Min
-40
1843
Typical
-
2048
0.5 (xy)
3 (z)
Max
85
2253
794
counts/g
390
257
189
%/ºC
%
%
g
Hz
% of FS
%
µg
/
√Hz
1.1
0.03
819
410
273
205
0.01 (xy)
0.04 (z)
0.3
1.1 (xy)
0.6 (z)
1.5 (xy)
0.5 (z)
4000 (xy)
2000 (z)
0.1
2
750
844
430
289
221
FS1=1, FS0=0 (± 4g)
FS1=0, FS0=1 (± 6g)
FS1=0, FS0=0 (± 8g)
Sensitivity Variation from RT over Temp.
Offset Ratiometric Error (V
dd
= 3.3V ± 5%)
Sensitivity Ratiometric Error (V
dd
= 3.3V ± 5%)
Self Test Output change on Activation
Mechanical Resonance (-3dB)
Non-Linearity
Cross Axis Sensitivity
Noise Density (on filter pins)
2
1.9
1.1
Notes:
1. User selectable from CTRL_REGC
2. Resonance as defined by the dampened mechanical sensor.
36 Thornwood Dr. – Ithaca, NY 14850
tel: 607-257-1080 – fax:607-257-1146
www.kionix.com -
info@kionix.com
© 2009 Kionix – All Rights Reserved
310-1547-1007221647
Page 2 of 25
PART NUMBER:
± 2g Tri-axis Digital Accelerometer
Specifications
KXSD9-2050
Rev. 3
Jul-2010
Table 2. Electrical
(specifications are for operation at 3.3V and T = 25C unless stated otherwise)
Parameters
Supply Voltage (V
dd
)
Operating
I/O Pads Supply Voltage (V
IO
)
Operating (full power)
Motion Wake Up
Current Consumption
15Hz Mode
Standby
Output Low Voltage
Output High Voltage
Input Low Voltage
Input High Voltage
Input Pull-down Current
LPF (-3dB) = 50Hz
LPF (-3dB) = 100Hz
2
Power Up Time
LPF (-3dB) = 500Hz
LPF (-3dB) = 1,000Hz
LPF (-3dB) = 2,000Hz
A/D Conversion time
SPI Communication Rate
I C Communication Rate
Bandwidth (-3dB)
4
2
3
1
Units
V
V
µA
V
V
V
V
µA
Min
1.8
1.7
120
Typical
3.3
220
40
Max
3.6
V
dd
320
75
0.3 * V
io
-
0.2 * V
io
-
-
0.9 * V
io
-
0.8 * V
io
ms
µs
MHz
KHz
Hz
40
0.1
-
-
-
-
0
15.9
8.0
1.6
0.8
0.4
200
1
400
50
60
Notes:
1. Assuming I C communication and minimum 1.5Kohm pull-up resistor on SCL and
SDA.
2. Power up time is determined after the enabling of the part and is determined by the
low-pass filter (LPF) set in CTRL_REGC.
3. SPI Communication Rate can be optimized for faster communication per the SPI
timing diagram below.
4. Factory programmable to have a switched capacitor low pass filter at 2kHz, 1kHz,
500Hz, 100Hz, 50Hz or no low pass filter. Optionally, the user can define with in
CTRL_REGC. Maximum defined by the frequency response of the sensors.
2
36 Thornwood Dr. – Ithaca, NY 14850
tel: 607-257-1080 – fax:607-257-1146
www.kionix.com -
info@kionix.com
© 2009 Kionix – All Rights Reserved
310-1547-1007221647
Page 3 of 25
PART NUMBER:
± 2g Tri-axis Digital Accelerometer
Specifications
KXSD9-2050
Rev. 3
Jul-2010
KXSD9 SPI Timing Diagram
t
1
t
2
t
3
t
4
t
5
t
6
t
7
nCS
SCLK
SDI
SDO
t
8
t
9
bit 7
bit 6
bit 1
bit 0
bit 7
bit 7
bit 6
bit 6
bit 1
bit 1
bit 0
bit 0
t
10
t
11
Table 3. SPI Timing
Number
-
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
t
11
Notes
Description
Enable transition from low to high after Vdd above 1.6V
nCS low to first SCLK setup time
SCLK pulse width: high (Does not apply to the last bit of a byte.)
SCLK pulse width: low (Does not apply to the last bit of a byte.)
SCLK pulse width: high (Only on last bit of a byte.)
SCLK pulse width: low (Only on last bit of a byte.)
nCS low after the final SCLK falling edge
nCS pulse width: high
SDI valid to SCLK rising edge
SCLK rising edge to SDI invalid
SCLK falling edge to SDO valid
SCLK falling edge to SDO invalid
Recommended SPI SCLK
A/D conversion SCLK hold (t
5
)
MIN
1
130
130
130
200
350
350
130
10
100
-
0
1
200
MAX
-
-
-
-
-
-
-
-
-
130
-
-
-
Units
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
us
36 Thornwood Dr. – Ithaca, NY 14850
tel: 607-257-1080 – fax:607-257-1146
www.kionix.com -
info@kionix.com
© 2009 Kionix – All Rights Reserved
310-1547-1007221647
Page 4 of 25
PART NUMBER:
± 2g Tri-axis Digital Accelerometer
Specifications
KXSD9-2050
Rev. 3
Jul-2010
Table 4. Environmental
Parameters
Supply Voltage (V
dd
) Absolute Limits
Operating Temperature Range
Storage Temperature Range
Mech. Shock (powered and unpowered)
ESD
HBM
Units
V
ºC
ºC
g
V
Min
-0.3
-40
-55
-
-
Typical
-
-
-
-
-
Max
6.0
85
150
5000 for 0.5ms
10000 for 0.2ms
2000
Caution: ESD Sensitive and Mechanical Shock Sensitive Component, improper handling
can cause permanent damage to the device.
This product conforms to Directive 2002/95/EC of the European Parliament and of the
Council of the European Union (RoHS). Specifically, this product does not contain lead,
mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), or
polybrominated diphenyl ethers (PBDE) above the maximum concentration values
(MCV) by weight in any of its homogenous materials. Homogenous materials are "of
uniform composition throughout."
This product is halogen-free per IEC 61249-2-21. Specifically, the materials used in this
product contain a maximum total halogen content of 1500 ppm with less than 900-ppm
bromine and less than 900-ppm chlorine.
HF
Soldering
Soldering recommendations are available upon request or from
www.kionix.com.
36 Thornwood Dr. – Ithaca, NY 14850
tel: 607-257-1080 – fax:607-257-1146
www.kionix.com -
info@kionix.com
© 2009 Kionix – All Rights Reserved
310-1547-1007221647
Page 5 of 25
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