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3.0SMCJ30-H

Description
Trans Voltage Suppressor Diode, 3000W, 30V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, SMC-F, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size73KB,9 Pages
ManufacturerFORMOSA
Websitehttp://www.formosams.com/
Download Datasheet Parametric View All

3.0SMCJ30-H Overview

Trans Voltage Suppressor Diode, 3000W, 30V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, SMC-F, 2 PIN

3.0SMCJ30-H Parametric

Parameter NameAttribute value
MakerFORMOSA
package instructionSMC-F, 2 PIN
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresEXCELLENT CLAMPING CAPABILITY
Maximum breakdown voltage36.8 V
Minimum breakdown voltage33.3 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-214AB
JESD-30 codeR-PDSO-C2
Maximum non-repetitive peak reverse power dissipation3000 W
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation6.5 W
Maximum repetitive peak reverse voltage30 V
surface mountYES
technologyAVALANCHE
Terminal formC BEND
Terminal locationDUAL
SMD Transient Voltage Suppressor
3.0SMCJ Series
List
Formosa MS
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3~4
Rating and characteristic curves........................................................ 4~5
Pinning information........................................................................... 6
Suggested solder pad layout............................................................. 6
Packing information.......................................................................... 7
Reel packing.................................................................................... 8
Suggested thermal profiles for soldering processes............................. 8
High reliability test capabilities........................................................... 9
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2013/03/01
Revision
D
Page.
9
Page 1
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