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MKI2F026801F00MISD

Description
CAPACITOR, METALLIZED FILM, POLYPHENYLENE SULPHIDE, 250V, 0.068uF, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size335KB,7 Pages
ManufacturerWIMA
Websitehttps://www.wima.de/
Environmental Compliance
Download Datasheet Parametric View All

MKI2F026801F00MISD Overview

CAPACITOR, METALLIZED FILM, POLYPHENYLENE SULPHIDE, 250V, 0.068uF, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIANT

MKI2F026801F00MISD Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerWIMA
package instruction,
Reach Compliance Codeunknow
ECCN codeEAR99
capacitance0.068 µF
Capacitor typeFILM CAPACITOR
dielectric materialsPOLYPHENYLENE SULPHIDE
JESD-609 codee3
Installation featuresTHROUGH HOLE MOUNT
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, 14 INCH
positive tolerance20%
Rated (AC) voltage (URac)160 V
Rated (DC) voltage (URdc)250 V
surface mountNO
Terminal surfaceTin (Sn)
Terminal shapeWIRE

MKI2F026801F00MISD Preview

WIMA MKI 2
Metallized Polyphenylene-Sulphide (PPS)
Capacitors in PCM 5 mm
D
Special Features
Operating temperature up to 140° C
Self-healing
Low dissipation factor
Low dielectric absorption
Very constant capacitance value
versus temperature
˜
According to RoHS 2002/95/EC
˜
˜
˜
˜
˜
Electrical Data
Capacitance range:
0.01
m
F to 1.0
m
F (E12-values on request)
Rated voltages:
63 VDC, 100 VDC, 250 VDC, 400 VDC
Capacitance tolerances:
± 20%, ± 10% (±5% available subject
to special enquiry)
Operating temperature range:
–55+ C to +140+ C
Climatic test category:
55/140/56 in accordance with IEC
Insulation resistance
at +20+ C:
U
r
63 VDC
U
test
50 V
C
0.33
mF
1 x 10
4
(mean value: 5 x 10
4
M¸)
1 x 10
4
(mean value: 5 x 10
4
M¸)
Test voltage:
1.6 U
r
, 2 sec.
Voltage derating:
A voltage derating factor of 0.75 % per K
must be applied from +125+ C for DC
voltages and from +110+ C for AC
voltages.
Reliability:
Operational life
300 000 hours
Failure rate
2 fit (0.5 x U
r
and 40) C)
Typical Applications
For general applications in high
temperature circuits e.g.
˜
By-pass
˜
Blocking
˜
Coupling and decoupling
˜
Timing
˜
Filtering
˜
Oscillating circuits
0.33
mF
< C
1.0
mF
3000 sec (M¸ x
mF)
(mean value: 6 000 sec)
100
VDC 100 V
Construction
Dielectric:
Polyphenylene-sulphide (PPS) film
Capacitor electrodes:
Vacuum-deposited
Internal construction:
Plastic film
Vacuum-deposited
electrode
Metal contact layer
(schoopage)
Terminating wire
Measuring time: 1 min.
Dissipation factors
at + 20) C: tan
d
at f
1 kHz
10 kHz
100 kHz
Maximum pulse rise time:
Capacitance
mF
0.01
0.033
0.1
0.68
...
...
...
...
0.022
0.068
0.47
1.0
Pulse rise time V/msec
max. operation/test
100 VDC
250 VDC
15/150
12/120
50/500
40/400
40/400
C
0.1
mF
15 x 10
-4
20 x 10
-4
50 x 10
-4
0.1
mF
< C
1.0
mF
20 x 10
-4
25 x 10
-4
63 VDC
15/150
12/120
400 VDC
60/600
50/500
for pulses equal to the rated voltage
Encapsulation:
Solvent-resistant, flame-retardant plastic
case with epoxy resin seal, UL 94 V-0
Terminations:
Tinned wire.
Marking:
Colour: Red. Marking: White.
Epoxy resin seal: Red
Mechanical Tests
Pull test on leads:
10 N in direction of leads according to
IEC 60068-2-21
Vibration:
6 hours at 10 ... 2000 Hz and 0.75 mm
displacement amplitude or 10 g in
accordance with IEC 60068-2-6
Low air density:
1kPa = 10 mbar in accordance with
IEC 60068-2-13
Bump test:
4000 bumps at 390 m/sec
2
in accordance with IEC 60068-2-29
Packing
Available taped and reeled.
Detailed taping information and graphs
at the end of the catalogue.
For further details and graphs please
refer to Technical Information.
46
01.10
WIMA MKI 2
Continuation
D
General Data
Capacitance
0.1
0.15
0.22
0.33
0.47
0.68
1.0
mF
mF
W
3
3
3.5
4.5
5
5.5
7.2
H
7.5
7.5
8.5
9.5
10
11.5
13
63 VDC/40 VAC*
L PCM**
Part number
7.2
7.2
7.2
7.2
7.2
7.2
7.2
5
5
5
5
5
5
5
MKI2C031001B00_ _ _ _
MKI2C031501B00_ _ _ _
MKI2C032201C00_ _ _ _
MKI2C033301E00_ _ _ _
MKI2C034701F00_ _ _ _
MKI2C036801H00_ _ _ _
MKI2C041001K00_ _ _ _
W
3
3.5
4.5
5
5.5
7.2
8.5
H
7.5
8.5
9.5
10
11.5
13
14
100 VDC/63 VAC*
L PCM**
Part number
7.2
7.2
7.2
7.2
7.2
7.2
7.2
5
5
5
5
5
5
5
MKI2D031001B00_ _ _ _
MKI2D031501C00_ _ _ _
MKI2D032201E00_ _ _ _
MKI2D033301F00_ _ _ _
MKI2D034701H00_ _ _ _
MKI2D036801K00_ _ _ _
MKI2D041001M00_ _ _ _
Capacitance
0.01
0.015
0.022
0.033
0.047
0.068
mF
W
H
L
250 VDC/160 VAC*
PCM**
Part number
W
3.5
4.5
5
5.5
7.2
H
8.5
9.5
10
11.5
13
L
400 VDC/200 VAC*
PCM**
Part number
5
5
5
5
5
MKPIG021001C00_ _ _ _
MKPIG021501E00_ _ _ _
MKPIG022201F00_ _ _ _
MKPIG023301H00_ _ _ _
MKPIG024701K00_ _ _ _
3.5
3.5
4.5
5
5.5
7.2
8.5
8.5
8.5
9.5
10
11.5
13
14
7.2
7.2
7.2
7.2
7.2
7.2
7.2
5
5
5
5
5
5
5
MKI2F022201C00_ _ _ _
MKI2F023301C00_ _ _ _
MKI2F024701E00_ _ _ _
MKI2F026801F00_ _ _ _
MKI2F031001H00_ _ _ _
MKI2F031501K00_ _ _ _
MKI2F032201M00_ _ _ _
7.2
7.2
7.2
7.2
7.2
0.1
mF
0.15 „
0.22 „
* AC voltage: f
400 Hz; 1.4 x U
rms
+ UDC
U
r
** PCM = Printed circuit module = lead spacing.
Dims. in mm.
W
H
6
-2
Part number completion:
Tolerance:
20 % = M
10 % = K
5%=J
Packing:
bulk = S
Lead length: 6-2 = SD
L
d = 0.5
l
d
5
PCM
at the lead exit points
(
0.5)
Taped version see page 140.
Impedance change with frequency
(general guide).
Rights reserved to amend design data without prior notification.
Permissible AC voltage in relation to
frequency at 10) C internal tempera-
ture rise (general guide).
01.10
47
D
Recommendation for Processing
and Application of
Through-Hole Capacitors
Soldering Process
A preheating of through-hole WIMA
capacitors is allowed for temperatures
T
max
100 ° C.
In practice a preheating duration of
t
5 min. has been proven to be best.
Single wave soldering
Soldering bath temperature: T
260 ° C
Immersion time:
t
5 sec
Double wave soldering
Soldering bath temperature: T
260 ° C
Immersion time:
2 x t
3 sec
Due to different soldering processes and
heat requirements the graphs are to be
regarded as a recommendation only.
Wave soldering
T
260
240
220
200
180
160
140
120
100
80
60
40
20
[°C]
see detail-
enlargement
2s
3s
10 s
t
30
60
90
120
150
180
210
240 [sec]
Typical temperature/time graph for double wave soldering
WIMA Quality and Environmental Philosophy
ISO 9001:2000 Certification
ISO 9001:2000 is an international basic
standard of quality assurance systems for
all branches of industry. The approval
according to ISO 9001:2000 of our
factories by the VDE inspectorate certifies
that organisation, equipment and moni-
toring of quality assurance in our factories
correspond to internationally recognized
standards.
WIMA Environmental Policy
All WIMA capacitors, irrespective of
whether through-hole devices or SMD,
are made of environmentally friendly
materials. Neither during manufacture
nor in the product itself any toxic
substances are used, e.g.
Lead
PCB
CFC
Hydrocarbon chloride
Chromium 6+
PBB/PBDE
Arsenic
Cadmium
Mercury
etc.
RoHS Compliance
According to the RoHS Directive 2002/95/EC
certain hazardous substances like e.g. lead,
cadmium, mercury must not be used any
longer in electronic equipment as of July 1st,
2006. For the sake of the environment WIMA
has refraind from using such substances since
years already.
WIMA WPCS
The WIMA Process Control System (WPCS)
is a quality surveillance and optimization
system developed by WIMA. WPCS is a
major part of the quality-oriented WIMA
production. Points of application of WPCS
during production process:
incoming material inspection
metallization
film inspection
schoopage
pre-healing
lead attachment
cast resin preparation/
encapsulation
100% final inspection
AQL check
We merely use pure, recyclable materials
for packing our components, such as:
carton
cardboard
adhesive tape made of paper
polystyrene
We almost completely refrain from using
packing materials such as:
foamed polystyrene (Styropor®)
adhesive tapes made of plastic
metal clips
Tape for lead-free WIMA capacitors
DIN EN ISO 14001:2005
WIMA’s environmental management has
been established in accordance with the
guidelines of DIN EN ISO 14001:2005.
The certification has been granted in
June 2006.
16
01.10
D
Typical Dimensions for
Taping Configuration
P
2
P
Vh
H
H
1
W
2
P
1
Diagram 1:
PCM 2.5/5/7.5mm
W
0
D
0
F
P
0
P
d
P
W
W
1
H
1
t
P
1
P
1
H
d
F
P
0
P
2
F
P
2
d
P
0
Diagram 2: PCM 10/15 mm
Diagram 3: PCM 22.5 and 27.5*mm
*PCM 27.5 taping possible with two feed holes between components
Dimensions for Radial Taping
Designation
Carrier tape width
Hold-down tape width
Hole position
Hold-down tape position
Feed hole diameter
Pitch of component
Feed hole pitch
Feed hole centre
to lead
Hole centre to
component centre
Feed hole centre to bottom
edge of the component
Feed hole centre to top
edge of the component
Lead spacing at
upper edge of carrier tape
Lead diameter
Component alignment
Total tape thickness
Package
(see also page 141)
Unit
Dims in mm.
Symbol
PCM 2.5 taping
W
W
0
W
1
W
2
D
0
P
P
0
P
1
P
2
H
H
1
F
d
Dh
t
18.0
p0.5
6.0
for hot-sealing
adhesive tape
PCM 5 taping
18.0
p0.5
6.0
for hot-sealing
adhesive tape
PCM 7.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 10 taping*
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 15 taping*
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 22.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
PCM 27.5 taping
18.0
p0.5
12.0
for hot-sealing
adhesive tape
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
12.7
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
25.4
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
25.4
p1.0
12.7
cumulative pitch
p0.3
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
38.1
p1.5
12.7
p0.3
7.8
p0.7
19.05
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
30.0 to 43.0
22.5
p0.8
0.8
–0.05
p
3.0 max.
0.7
p0.2
54
p2
B 60
p2
68
p2
depending
on PCM and
component dimensions
+0,08
cumulative pitch
error max.
1.0 mm/20 pitch
9.0
p0.5
0.5 to 3.0 max.
4.0
p0.2
*
38.1
p1.5
or 50.8
p1.5
12.7
p0.3
5.3
p0.7
19.05
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
35.0 to 45.0
27.5
p0.8
0.8
–0.05
p
3.0 max.
0.7
p0.2
+0.08
cumulative pitch
error max.
1.0 mm/20 pitch
5.1
p0.5
6.35
p1.3
16.5
p0.3
18.5
p0.5
H+H
component
< H
1
32.25 max.
2.5
p0.5
0.4
p0.05
p
2.0 max.
0.7
p0.2
3.85
p0.7
6.35
p1.3
16.5
p0.3
18.5
p0.5
H+H
component
< H
1
32.25 max.
5.0
+0.8
–0.2
2.6
p0.7
6.35
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
24.5 to 31.5
7.5
p0.8
7.7
p0.7
12.7
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
25.0 to 31.5
10.0
p0.8
+0.06
5.2
p0.7
12.7
p1.3
16.5
p0.5
18.5
p0.5
H+H
component
< H
1
26.0 to 37.0
15
p0.8
+0,06
0.5
p0.05
p
2.0 max.
0.7
p0.2
ROLL/AMMO
0.5
p0.05
or
0.6
–0.05
0.5
p0.05
or
0.6
–0.05
0.8
–0.05
p
3.0 max.
0.7
p0.2
AMMO
+0,08
p
3.0 max.
0.7
p0.2
p
3.0 max.
0.7
p0.2
52
p2
B 58
p2
or
66
p2
REEL
P
360 max.
P
30
p1
B
52
p2
58
p2
depending on
comp. dimensions
REEL
P
360 max.
P
30
p1
REEL
P
500 max.
P
25
p1
see details page 143.
Please clarify customer-specific deviations with the manufacturer.
Diameter of leads see General Data.
140
01.10
*
PCM 10 and PCM 15 can be crimped to PCM 7.5.
Position of components according to PCM 7.5 (sketch 1). P
0
= 12.7 or 15.0 is possible
D
Packing Quantities for Bulk Capacitors and TPS*
pcs. per packaging unit bulk
Mini
Standard
Maxi
M
S
G
1000
5000
10 000
1000
5000
10 000
1000
5000
10 000
1000
5000
10 000
1000
5000
10 000
2000
5000
10 000
1000
5000
1000
5000
1000
6000
1000
4000
1000
3500
1000
4000
500
2500
1000
2500
500
2500
500
2000
500
2000
500
1500
250
1000
1000
5000
1000
5000
1000
4000
1000
3500
1000
3000
2000
500
500
1500
1000
3000
3000
500
1000
3000
1000
3000
500
2000
1000
3000
800
2400
800
2400
500
2000
800
2400
200
1000
500
2000
250
1000
400
1600
250
1000
1200
400
100
500
400
1200
300
900
100
500
300
1000
300
1200
250
1000
190
760
Moulded versions.
PCM
Size
W
2.5
3
3.8
4.6
5.5
2.5
3
3.5
4.5
4.5
5
5.5
5.5
6.5
7.2
7.2
8.5
8.5
11
2.5
3
4
4.5
5
5.7
7.2
3
4
4
4
5
5
6
6
8
5
5
6
6
7
7
8
8
9
9
10
11
5
6
7
8
8.5
10
10.5
10.5
11
12
9
11
13
13
15
15
17
17
20
20
9
11
13
15
17
19
20
24
H
7
7.5
8.5
9
10
6.5
7.5
8.5
6
9.5
10
7
11.5
8
8.5
13
10
14
16
7
8.5
9
9.5
10.5
12.5
12.5
9
8.5
9
9.5
10
11
12
12.5
12
11
13
12.5
14
14
15
15
17
14
16
18
14
14
15
16.5
20
18.5
22
19
20.5
21
24
19
21
24
25
26
26
29
34.5
32
39.5
19
22
24
26
29
32
39.5
45.5
L
4.6
4.6
4.6
4.6
4.6
7.2
7.2
7.2
7.2
7.2
7.2
7.2
7.2
7.2
7.2
7.2
7.2
7.2
7.2
10
10
10
10.3
10.3
10.3
10.3
13
13.5
13
13
13.5
13
13
13
13
18
19
18
19
18
19
18
19
18
18
19
18
26.5
26.5
26.5
28
26.5
28
26.5
26.5
26.5
28
31.5
31.5
31.5
33
31.5
33
31.5
31.5
33
31.5
41.5
41.5
41.5
41.5
41.5
41.5
41.5
41.5
Codes
0B
0C
0D
0E
0F
1A
1B
1C
1D
1E
1F
1G
1H
1I
1J
1K
1L
1M
1N
2A
2B
2C
2D
2E
2F
2G
3A
FA
3C
3D
FB
3F
3G
3H
3I
4B
FC
4C
FD
4D
FE
4H
FF
4F
4J
FG
4M
5A
5B
5D
FH
5F
FI
5G
5H
5I
FJ
6A
6B
6D
FK
6F
FL
6G
6I
FM
6J
7A
7B
7C
7D
7E
7F
7G
7H
2.5 mm
5 mm
7.5 mm
10 mm
15 mm
22.5 mm
27.5 mm
37.5 mm
142
Rights reserved to amend design data without prior notification.
Samples and pre-production needs on request.
* Tray-Packing-System
01.10
pcs. per packaging unit/TPS*
Mini
Standard
X
Y
115
690
220
880
90
540
170
680
170
680
170
680
75
450
160
640
136
544
112
448
56
336
96
384
48
288
88
176
88
176
36
216
36
144
60
480
51
408
84
252
72
144
66
132
54
108
27
108
21
84
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一百年后的自己 51mcu
LED chip detection problem
LED chips are the core components of the LED industry, and excessive chip temperature will seriously affect the quality of LED products. However, the temperature distribution of the chip and the insid...
科努德 Test/Measurement
Officially provided: National Technology N32G457xx data package
Special reminder, friends who participated in the evaluation, please take a look~ @jinglixixi @ yang377156216 @lugl4313820@oxygen_sh@ fxyc87The contents of the information package are as follows:Folde...
nmg Domestic Chip Exchange
AND
Does anyone know how to use IAR? I used KEIL before. Now I have a project written in IAR, but it always fails when I compile it. Can anyone help me? Thanks...
曹伟1993 ARM Technology

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