SiP2211 is a dual output low dropout regulator capable of
supplying 150 mA from output 1 and 300 mA from output 2.
The SiP2211 has the outputs independently enabled. Also
the SiP2211 offers a low dropout, low ground current and
extremely low noise with the addition of a bypass capacitor.
Protection features include undervoltage lockout, output
current limit, and thermal shutdown.
The Fixed output version of SiP2211 is available in a lead
(Pb)-free MLP33-10 PowerPAK package and the adjustable
version is available in a lead (Pb)-free MLP44-16 PowerPak
package. Both packages ares specified to operate over the
range of - 40 °C to 85 °C.
FEATURES
•
•
•
•
•
•
•
•
2.25 V to 5.5 V Input Voltage Range
Two Outputs - 150 mA and 300 mA
Low Ground Current of 48 µA
Low Dropout Voltage of 65 mV at 100 mA
Current Limit
Thermal Shutdown
MLP33-10 PowerPAK
®
Package (Fixed Output)
MIC2211 Pin for Pin Replacement
RoHS
COMPLIANT
APPLICATIONS
• Cellular Phones
• Wireless Modems
• PDAs
TYPICAL APPLICATION CIRCUIT
V
IN
EN
1
EN
2
V
OUT1
V
OUT2
SiP2211
BP
GND
Document Number: 73479
S-71832-Rev. C, 03-Sep-07
www.vishay.com
1
SiP2211
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS
Parameter
V
IN
, V
EN
, to GND
Power Dissipation
Storage Temperature
Thermal Resistance (MLP10 PowerPAK)
Notes:
a. Device Mounted with all leads soldered or welded to PC board.
b. Derate 20 mW/°C above 70 °C.
c. Derate 23.5 mW/°C above 70 °C.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Limit
- 0.3 to 7
MLP33-10 PowerPAK
b
MLP44-16 PowerPAK
c
1600
1880
- 55 to 150
50
Unit
V
mW
°C
°C/W
RECOMMENDED OPERATING RANGE
Parameter
Input Voltage Range
Enable Voltage Range
Operating Temperature Range T
A
Operating Temperature Range T
J
Limit
2.25 to 5.5
0 to 5.5
- 40 to 85
- 40 to 125
Unit
V
°C
SPECIFICATIONS
Test Conditions Unless Specified
V
IN
= V
OUT
+ 1
Parameter
Regulators
Output Voltage Accuracy
Output Voltage
Temperature Coefficient
Line Regulation
e
Load Regulation
V
IN
= V
OUT
+ 1 V to 5.5 V
I
OUT
= 100 µA to 150 mA (LDO 1 and 2)
I
OUT
= 100 µA to 300 mA (LDO 2)
I
OUT
= 150 mA (LDO 1 and 2)
Dropout Voltage
f
V
DROP
I
OUT
= 300 mA (LDO 2)
I
OUT1
= I
OUT2
= 0 µA
Ground Pin Current
I
G
I
OUT1
= I
OUT2
= 0 µA
I
OUT1
= 150 mA, I
OUT2
= 300 mA
V
EN
< 0.4 V
Sequence Time Delay
d
Output Voltage Noise
Ripple Rejection
Inputs
EN Input Voltage
EN Input Current
V
IL
V
IH
I
IL
I
IH
Logic Low
Logic High
V
IL
< 0.6 V
V
IH
> 1.8 V
Full
Full
Room
Room
1.8
-1
-1
0.01
0.01
1
1
0.6
V
µA
t
SEQ
C
BP
= 0.01 µF
f = 1 kHz, C
OUT
= 1 µF, C
BP
= 10 nF
f = 20 kHz, C
OUT
= 1 µF, C
BP
= 10 nF
Room
Room
From Nominal V
OUT
Room
Full
Room
Room
Full
Room
Room
Room
Full
Room
Full
Room
Full
Room
Full
Room
70
30
60
40
60
2.0
µs
µVrms
dB
48
240
120
- 0.3
- 0.6
0.2
-1
-2
40
0.2
0.3
0.6
1.0
1.5
190
250
340
420
65
80
µA
mV
%
1
2
%
ppm/°C
Symbol
V
e
,
C
OUT
1 µF, I
OUT
= 100 µA,
T
A
= 25 °C
Temp
a
Min
b
Limits
Typ
c
Max
b
Unit
www.vishay.com
2
Document Number: 73479
S-71832-Rev. C, 03-Sep-07
SiP2211
Vishay Siliconix
SPECIFICATIONS
Test Conditions Unless Specified
V
IN
= V
OUT
+ 1 V
e
, C
OUT
Parameter
Protection
Current Limit
Thermal Shutdown Temperature
Thermal Hysteresis
I
IL
V
OUT1
= 0 V
V
OUT1
= 0 V
Room
Room
Room
Room
150
300
280
450
165
25
460
700
mA
°C
Symbol
1 µF, I
OUT
= 100 µA,
T
A
= 25 °C
Temp
a
Min
b
Limits
Typ
c
Max
b
Unit
Notes:
a. Room = 25 °C, Full = - 40 to 85 °C.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. Timing is measured from 90 % of LDO #1’s final value to 90 % of LDO #2’s final value.
e. For higher output of the regulator pair.
f. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 2 % below the output voltage measured
with a 1 V differential, provided that V
IN
does not drop below 2.25 V. When V
OUT(nom)
is less than 2.25 V, the output will be in regulation when
2.25 V - V
OUT(nom)
is greater than the dropout voltage specified.
FUNCTIONAL BLOCK DIAGRAM
V
IN
EN
1
LDO #1
V
OUT1
LDO #2
EN
2
V
OUT2
BP
Reference
GND
Fixed Voltage Version
V
IN
EN
1
LDO #1
V
OUT1
ADJ
1
LDO #2
V
OUT2
ADJ
2
EN
2
BP
Reference
GND
Adjustable
Voltage V
ersion
Document Number: 73479
S-71832-Rev. C, 03-Sep-07
www.vishay.com
3
SiP2211
Vishay Siliconix
PIN CONFIGURATION AND ORDERING INFORMATION
PowerPAK MLP33-10 with Large Pad
VOLTAGE OPTIONS
V
IN
EN
1
EN
2
BP
NC
1
2
3
4
5
10
9
8
7
6
V
OUT1
V
OUT1
V
OUT2
V
OUT2
NC
NC
GND
NC
NC
GND
10
9
8
7
6
1
2
3
4
5
V
IN
EN
1
EN
2
BP
NC
Voltage
Adj
1.5
1.6
1.8
1.85
1.9
2.0
2.1
2.5
2.6
2.7
2.8
2.85
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
Code (x, Z)
A
F
W
G
D
Y
H
E
J
K
L
M
N
O
P
Q
R
S
T
U
V
Exposed Pad
Top
View
V
OUT1
V
OUT2
Bottom
View
13
14
15
16
NC
NC
ADJ
2
GND
SW
12
11
10
9
8
G
N
D
7
G
N
D
6
N
C
5
N
C
V
I
N
1
2
3
4
V
I
N
EN
1
EN
2
BP
ADJ
1
Bottom
View
ORDERING INFORMATION
Part Number
SiP2211DMP-XZ-E3
SiP2211DLP-AA-E3
X: Output 1 voltage code
Z: Output 2 voltage code
Temp Range
- 40 to 85 °C
Package
PowerPAK MLP33-10
PowerPAK MLP44-16
Marking
11XZ
11AA
PIN DESCRIPTION
Pin Number
MLP33-10
1
2
3
4
5
6
MLP44-16
15, 16
1
6
2
3
4
5
7, 8
9
10
7
8
9
10
11
12
13
14
Name
V
IN
EN
1
NC
EN
2
BP
ADJ
1
NC
GND
GND
SW
ADJ
2
NC
NC
V
OUT2
V
OUT1
Function
Input voltage for the power MOSFETs and their gate drive
Enables LDO #1 output
No Connection
Enables LDO #2 output
Bypass for noise reduction
Feedback connection for LDO #1
No Connection
Ground
Ground for the internal N-Channel MOSFET switch
Feedback connection for LDO #2
No Connection
No Connection
Output of LDO #2 - 300 mA
Output of LDO #1 - 150 mA
The exposed pad on both packages must be connected externally to the GND pin.
Automotive Electrical and Electronic Technology : https://training.eeworld.com.cn/course/67814This course is built on the basis of courses such as "Electrical Technology", "Electronic Technology" and ...
1. Change the cmd of the project to be burned to
-stack 0x1000
-heap 0x400MEMORY
{
//CORE0
DDR3: o = 0x80000000, l = 0x01000000
BOOT_CORE0: o = 0x10800000, l = 0x000000c0
L2: o = 0x108000c0, l = 0x000...
I saved a KiCad tutorial. Seeing that many netizens want to learn KiCad, I uploaded it to the University Hall. Let's learn together~ How many netizens want to learn and use KiCad, please raise your ha...
As we all know, compared with last year, Huawei faced greater challenges this year. When the whole world thought that Huawei was about to press the "pause button", Huawei resolutely chose to press the...
It is necessary to use TM4C to read data through IIC. The hardware is not easy to transplant, so I wrote a software to simulate IIC. SDA and SCL are both externally pulled up by resistors. At the begi...
Power amplifiers are divided into the following four types according to their working status:
(1) Class A working state The collector current of the transistor is always flowing during the entire work...
Some Huawei smartphone users in European countries have suddenly found ads popping up on their phone lock screens. Huawei initially denied any involvement and blamed third-party apps for the problem....[Details]
Abstract: With the emergence of new technologies and processes, high-speed microcontrollers are increasingly being used, which puts higher demands on hardware reliability. This article will describ...[Details]
1 Introduction
The ultra-low frequency virtual digital storage oscilloscope is essentially based on PC586 as the working platform, equipped with an expansion interface card MS with specific functi...[Details]
1 Introduction
In recent years, the development of robots has spread across the fields of machinery, electronics, metallurgy, transportation, aerospace, national defense, etc., and the intelli...[Details]
The global automotive industry has shown a very clear trend, with more and more automakers accelerating their own research and production of batteries. The rapid growth of global new energy vehicle...[Details]
Recently, there are reports that the price of the Chinese version of Samsung Galaxy Fold may be 14,999 yuan, and it is limited to 9,999 units. Whether the quantity will be increased later depends on ...[Details]
5G mobile phones seem to be really popular this year. According to the data from the China Academy of Information and Communications Technology, in May 2020, the total shipments of the domestic mobil...[Details]
At present, single-chip microcomputers have been widely used in electronic products. Many types of single-chip microcomputers have internal A/D conversion circuits, but the price of such singl...[Details]
According to foreign media reports, researchers at Israel's Ben Gurion University have found that at least two ADAS systems are prone to reacting to images that flash for a moment. (Image source: ...[Details]
BMS
A battery management system (BMS) is a system that manages batteries. It usually has the function of measuring battery voltage to prevent or avoid abnormal conditions such as over-discharg...[Details]
Connected Energy in the UK is one of the world's largest second life BESS companies, and its batteries mainly come from Renault. Image: Connected Energy
Nissan, Renault ...[Details]
On November 18, the signing ceremony of the All-Core Semiconductor Packaging and Testing Zhaoqing Base Project was held in Songshan Lake, Dongguan City. The Allcore Semiconductor Packaging and Test...[Details]
introduction
Conflicting design requirements such as high reliability, low cost, and extremely short development cycles force power supply designers to adopt new and groundbreaking technical s...[Details]
On June 3, according to the Beijing Securities Regulatory Bureau, CITIC Securities issued a summary report on the guidance work for the initial public offering and listing on the Growth Enterprise Ma...[Details]
With the development of AI technology, AI and the wearable device industry are becoming more and more integrated, including Bluetooth chips, algorithms, applications and other upstream and downstre...[Details]
Automotive Electronics
京公网安备 11010802033920号
EEWORLD
