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S71WS256RD0HH3092

Description
Flash, 16MX16, 80ns, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
Categorystorage    storage   
File Size536KB,12 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
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S71WS256RD0HH3092 Overview

Flash, 16MX16, 80ns, PBGA84, 11.60 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

S71WS256RD0HH3092 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA, BGA84,10X12,32
Contacts84
Reach Compliance Codeunknow
ECCN code3A991.B.1.A
Maximum access time80 ns
JESD-30 codeR-PBGA-B84
length11.6 mm
memory density268435456 bi
Memory IC TypeFLASH
memory width16
Mixed memory typesFLASH+PSRAM
Number of functions1
Number of terminals84
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-30 °C
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA84,10X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
power supply1.8 V
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width8 mm
S71WS-R based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode
Flash Memory with CellularRAM
Data Sheet
(Advance Information)
S71WS-R based MCP Products Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71WS-R_00
Revision
03
Issue Date
November 19, 2008

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