T2081NXE8TTB datasheet, PDF - EEWORLD Datasheet

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T2081NXE8TTB: DescriptionRISC Microprocessor, 1800MHz, CMOS, PBGA780; CategoryThe embedded processor and controller Microcontrollers and processors; File Size274KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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T2081NXE8TTB Overview

RISC Microprocessor, 1800MHz, CMOS, PBGA780

T2081NXE8TTB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
package instruction	FBGA,
Reach Compliance Code	compli
Address bus width	16
boundary scan	YES
External data bus width	64
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B780
length	23 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	780
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)	250
Maximum seat height	2.61 mm
speed	1800 MHz
Maximum supply voltage	1.055 V
Minimum supply voltage	0.995 V
Nominal supply voltage	1.025 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	23 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

T2081NXE8TTB Related Products

	T2081NXE8TTB	T2081NXN8MQLB	T2081NXN8P1B	T2081NXN8T1B
Description	RISC Microprocessor, 1800MHz, CMOS, PBGA780	RISC Microprocessor, 1200MHz, CMOS, PBGA780	RISC Microprocessor, 1533MHz, CMOS, PBGA780	RISC Microprocessor, 1800MHz, CMOS, PBGA780
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP
package instruction	FBGA,	FBGA,	FBGA,	FBGA,
Reach Compliance Code	compli	compli	compli	compli
Address bus width	16	16	16	16
boundary scan	YES	YES	YES	YES
External data bus width	64	64	64	64
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	YES
JESD-30 code	S-PBGA-B780	S-PBGA-B780	S-PBGA-B780	S-PBGA-B780
length	23 mm	23 mm	23 mm	23 mm
low power mode	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3
Number of terminals	780	780	780	780
Maximum operating temperature	105 °C	105 °C	105 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA	FBGA	FBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)	250	250	250	250
Maximum seat height	2.61 mm	2.61 mm	2.61 mm	2.61 mm
speed	1800 MHz	1200 MHz	1533 MHz	1800 MHz
Maximum supply voltage	1.055 V	1.055 V	1.055 V	1.055 V
Minimum supply voltage	0.995 V	0.995 V	0.995 V	0.995 V
Nominal supply voltage	1.025 V	1.025 V	1.025 V	1.025 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30
width	23 mm	23 mm	23 mm	23 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
ECCN code	-	3A991.A.1	3A991.A.1	3A991.A.1

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