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T2081NXN8MQLB

Description
RISC Microprocessor, 1200MHz, CMOS, PBGA780
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size274KB,3 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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T2081NXN8MQLB Overview

RISC Microprocessor, 1200MHz, CMOS, PBGA780

T2081NXN8MQLB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
package instructionFBGA,
Reach Compliance Codecompli
ECCN code3A991.A.1
Address bus width16
boundary scanYES
External data bus width64
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B780
length23 mm
low power modeYES
Humidity sensitivity level3
Number of terminals780
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)250
Maximum seat height2.61 mm
speed1200 MHz
Maximum supply voltage1.055 V
Minimum supply voltage0.995 V
Nominal supply voltage1.025 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width23 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

T2081NXN8MQLB Related Products

T2081NXN8MQLB T2081NXE8TTB T2081NXN8P1B T2081NXN8T1B
Description RISC Microprocessor, 1200MHz, CMOS, PBGA780 RISC Microprocessor, 1800MHz, CMOS, PBGA780 RISC Microprocessor, 1533MHz, CMOS, PBGA780 RISC Microprocessor, 1800MHz, CMOS, PBGA780
Is it Rohs certified? conform to conform to conform to conform to
Maker NXP NXP NXP NXP
package instruction FBGA, FBGA, FBGA, FBGA,
Reach Compliance Code compli compli compli compli
Address bus width 16 16 16 16
boundary scan YES YES YES YES
External data bus width 64 64 64 64
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES
JESD-30 code S-PBGA-B780 S-PBGA-B780 S-PBGA-B780 S-PBGA-B780
length 23 mm 23 mm 23 mm 23 mm
low power mode YES YES YES YES
Humidity sensitivity level 3 3 3 3
Number of terminals 780 780 780 780
Maximum operating temperature 105 °C 105 °C 105 °C 105 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA FBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) 250 250 250 250
Maximum seat height 2.61 mm 2.61 mm 2.61 mm 2.61 mm
speed 1200 MHz 1800 MHz 1533 MHz 1800 MHz
Maximum supply voltage 1.055 V 1.055 V 1.055 V 1.055 V
Minimum supply voltage 0.995 V 0.995 V 0.995 V 0.995 V
Nominal supply voltage 1.025 V 1.025 V 1.025 V 1.025 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 30
width 23 mm 23 mm 23 mm 23 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
ECCN code 3A991.A.1 - 3A991.A.1 3A991.A.1

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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