RISC Microprocessor, 1200MHz, CMOS, PBGA780
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | NXP |
package instruction | FBGA, |
Reach Compliance Code | compli |
ECCN code | 3A991.A.1 |
Address bus width | 16 |
boundary scan | YES |
External data bus width | 64 |
Format | FIXED POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B780 |
length | 23 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 780 |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Package shape | SQUARE |
Package form | GRID ARRAY, FINE PITCH |
Peak Reflow Temperature (Celsius) | 250 |
Maximum seat height | 2.61 mm |
speed | 1200 MHz |
Maximum supply voltage | 1.055 V |
Minimum supply voltage | 0.995 V |
Nominal supply voltage | 1.025 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 23 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
T2081NXN8MQLB | T2081NXE8TTB | T2081NXN8P1B | T2081NXN8T1B | |
---|---|---|---|---|
Description | RISC Microprocessor, 1200MHz, CMOS, PBGA780 | RISC Microprocessor, 1800MHz, CMOS, PBGA780 | RISC Microprocessor, 1533MHz, CMOS, PBGA780 | RISC Microprocessor, 1800MHz, CMOS, PBGA780 |
Is it Rohs certified? | conform to | conform to | conform to | conform to |
Maker | NXP | NXP | NXP | NXP |
package instruction | FBGA, | FBGA, | FBGA, | FBGA, |
Reach Compliance Code | compli | compli | compli | compli |
Address bus width | 16 | 16 | 16 | 16 |
boundary scan | YES | YES | YES | YES |
External data bus width | 64 | 64 | 64 | 64 |
Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
Integrated cache | YES | YES | YES | YES |
JESD-30 code | S-PBGA-B780 | S-PBGA-B780 | S-PBGA-B780 | S-PBGA-B780 |
length | 23 mm | 23 mm | 23 mm | 23 mm |
low power mode | YES | YES | YES | YES |
Humidity sensitivity level | 3 | 3 | 3 | 3 |
Number of terminals | 780 | 780 | 780 | 780 |
Maximum operating temperature | 105 °C | 105 °C | 105 °C | 105 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | FBGA | FBGA | FBGA | FBGA |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 |
Maximum seat height | 2.61 mm | 2.61 mm | 2.61 mm | 2.61 mm |
speed | 1200 MHz | 1800 MHz | 1533 MHz | 1800 MHz |
Maximum supply voltage | 1.055 V | 1.055 V | 1.055 V | 1.055 V |
Minimum supply voltage | 0.995 V | 0.995 V | 0.995 V | 0.995 V |
Nominal supply voltage | 1.025 V | 1.025 V | 1.025 V | 1.025 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | BALL | BALL | BALL | BALL |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 |
width | 23 mm | 23 mm | 23 mm | 23 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
ECCN code | 3A991.A.1 | - | 3A991.A.1 | 3A991.A.1 |