32-BIT, 1000MHz, MICROPROCESSOR, CBGA783, 29 X 29 MM, 1 MM PITCH, FLIP CHIP, LEAD FREE, CERAMIC, BGA-783
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 783 |
Reach Compliance Code | compli |
ECCN code | 3A001.A.3 |
Address bus width | 64 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 133 MHz |
External data bus width | 64 |
Format | FLOATING POINT |
Integrated cache | YES |
JESD-30 code | S-CBGA-B783 |
JESD-609 code | e1 |
length | 29 mm |
low power mode | YES |
Number of terminals | 783 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 3.38 mm |
speed | 1000 MHz |
Maximum supply voltage | 1.155 V |
Minimum supply voltage | 1.045 V |
Nominal supply voltage | 1.1 V |
surface mount | YES |
technology | CMOS |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 29 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |