935298377125 datasheet, PDF - EEWORLD Datasheet

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935298377125: DescriptionLVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, 0.80 X 0.80 MM, 0.35 MM HEIGHT, PLASTIC, SOT-1226, X2SON-5; Categorylogic logic; File Size349KB，18 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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935298377125 Overview

LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, 0.80 X 0.80 MM, 0.35 MM HEIGHT, PLASTIC, SOT-1226, X2SON-5

935298377125 Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	SON,
Reach Compliance Code	unknow
series	LVC/LCX/Z
JESD-30 code	S-PDSO-N5
JESD-609 code	e3
length	0.8 mm
Logic integrated circuit type	BUFFER
Number of functions	1
Number of entries	1
Number of terminals	5
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output characteristics	OPEN-DRAIN
Package body material	PLASTIC/EPOXY
encapsulated code	SON
Package shape	SQUARE
Package form	SMALL OUTLINE
propagation delay (tpd)	8.4 ns
Maximum seat height	0.35 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	TIN
Terminal form	NO LEAD
Terminal pitch	0.48 mm
Terminal location	DUAL
width	0.8 mm

935298377125 Related Products

	935298377125	74LVC1G07GX,125	74LVC1G07GW,165
Description	LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, 0.80 X 0.80 MM, 0.35 MM HEIGHT, PLASTIC, SOT-1226, X2SON-5	IC buffer non-inv O-D x2son5	IC buff open drain N-inv 5tssop
Maker	NXP	NXP	NXP
package instruction	SON,	SON, LCC5(UNSPEC)	1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5
Reach Compliance Code	unknow	compli	unknown
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	S-PDSO-N5	S-PDSO-N5	R-PDSO-G5
JESD-609 code	e3	e3	e3
length	0.8 mm	0.8 mm	2.05 mm
Logic integrated circuit type	BUFFER	BUFFER	BUFFER
Number of functions	1	1	1
Number of entries	1	1	1
Number of terminals	5	5	5
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Output characteristics	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SON	SON	TSSOP
Package shape	SQUARE	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)	8.4 ns	8.4 ns	8.4 ns
Maximum seat height	0.35 mm	0.35 mm	1.1 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	1.8 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	TIN	Tin (Sn)	Tin (Sn)
Terminal form	NO LEAD	NO LEAD	GULL WING
Terminal pitch	0.48 mm	0.48 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL
width	0.8 mm	0.8 mm	1.25 mm
Brand Name	-	NXP Semiconduc	NXP Semiconductor
Is it Rohs certified?	-	conform to	conform to
Parts packaging code	-	SON	TSSOP
Contacts	-	5	5
Manufacturer packaging code	-	SOT1226	SOT353-1
MaximumI(ol)	-	0.024 A	0.024 A
Humidity sensitivity level	-	1	1
Encapsulate equivalent code	-	LCC5(UNSPEC)	TSSOP5/6,.08
method of packing	-	TAPE AND REEL	TAPE AND REEL
power supply	-	3.3 V	3.3 V
Certification status	-	Not Qualified	Not Qualified
Schmitt trigger	-	NO	NO

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