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MT58L512Y32FB-8.5

Description
Standard SRAM, 512KX32, 8.5ns, CMOS, PBGA119, PLASTIC, MS-028BHA, BGA-119
Categorystorage    storage   
File Size697KB,44 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT58L512Y32FB-8.5 Overview

Standard SRAM, 512KX32, 8.5ns, CMOS, PBGA119, PLASTIC, MS-028BHA, BGA-119

MT58L512Y32FB-8.5 Parametric

Parameter NameAttribute value
MakerMicron Technology
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time8.5 ns
JESD-30 codeR-PBGA-B119
JESD-609 codee1
length22 mm
memory density16777216 bi
Memory IC TypeSTANDARD SRAM
memory width32
Number of functions1
Number of terminals119
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height2.4 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width14 mm
ADVANCE
18Mb: 1 MEG x 18, 512K x 32/36
FLOW-THROUGH SYNCBURST SRAM
18Mb SYNCBURST
SRAM
FEATURES
• Fast clock and OE# access times
• Single +3.3V ±0.165V or +2.5V ±0.125V power supply
(V
DD
)
• Separate +3.3V or +2.5V isolated output buffer supply
(V
DD
Q)
• SNOOZE MODE for reduced-power standby
• Common data inputs and data outputs
• Individual BYTE WRITE control and GLOBAL WRITE
• Three chip enables for simple depth expansion and
address pipelining
• Clock-controlled and registered addresses, data I/Os,
and control signals
• Internally self-timed WRITE cycle
• Automatic power-down
• Burst control (interleaved or linear burst)
• Low capacitive bus loading
• x18, x32, and x36 versions available
MT58L1MY18F, MT58V1MV18F,
MT58L512Y32F, MT58V512V32F,
MT58L512Y36F, MT58V512V36F
3V V
DD
, 3.3V or 2.5V I/O; 2.5V V
DD
, 2.5V
I/O,
Flow-Through
100-Pin TQFP
1
165-Pin FBGA
OPTIONS
• Timing (Access/Cycle/MHz)
7.5ns/8.8ns/113 MHz
8.5ns/10ns/100 MHz
10ns/15ns/66 MHz
• Configurations
3.3V V
DD
, 3.3V or 2.5V I/O
1 Meg x 18
512K x 32
512K x 36
2.5V V
DD
, 2.5V I/O
1 Meg x 18
512K x 32
512K x 36
• Packages
100-pin TQFP (3-chip enable)
165-pin FBGA
119-pin BGA
• Operating Temperature Range
Commercial (0ºC to +70ºC)
TQFP MARKING
-7.5
-8.5
-10
MT58L1MY18F
MT58L512Y32F
MT58L512Y36F
MT58V1MV18F
MT58V512V32F
MT58V512V36F
T
F*
B
None
119-Pin BGA
2
Part Number Example:
MT58L512Y36FT-10
* A Part Marking Guide for the FBGA devices can be found on Micron’s
Web site—http://www.micron.com/support/index.html.
NOTE:
1. JEDEC-standard MS-026 BHA (LQFP).
2. JEDEC-standard MS-028 BHA (PBGA).
18Mb: 1 Meg x 18, 512K x 32/36 Flow-Through SyncBurst SRAM
MT58L1MY18F_C.p65 – Rev. C, Pub. 9/01
1
©2001, Micron Technology, Inc.
AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE
BY MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.
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