SAM E70/S70/V70/V71 Family
32-bit ARM Cortex-M7 MCUs with FPU, Audio and
Graphics Interfaces, High-Speed USB, Ethernet, and
Advanced Analog
Features
Core
• ARM
®
Cortex
®
-M7 running at up to 300 MHz
• 16 Kbytes of I-Cache and 16 Kbytes of D-Cache with Error Code Correction (ECC)
• Single-precision and double-precision HW Floating Point Unit (FPU)
• Memory Protection Unit (MPU) with 16 zones
• DSP Instructions, Thumb
®
-2 Instruction Set
• Embedded Trace Module (ETM) with instruction trace stream, including Trace Port Interface Unit (TPIU)
Memories
• Up to 2048 Kbytes embedded Flash with unique identifier and user signature for user-defined data
• Up to 384 Kbytes embedded Multi-port SRAM
• Tightly Coupled Memory (TCM)
• 16 Kbytes ROM with embedded Bootloader routines (UART0, USB) and IAP routines
• 16-bit Static Memory Controller (SMC) with support for SRAM, PSRAM, LCD module, NOR and NAND Flash
with on-the-fly scrambling
• 16-bit SDRAM Controller (SDRAMC) interfacing up to 256 MB and with on-the-fly scrambling
System
• Embedded voltage regulator for single-supply operation
• Power-on-Reset (POR), Brown-out Detector (BOD) and Dual Watchdog for safe operation
• Quartz or ceramic resonator oscillators: 3 MHz to 20 MHz main oscillator with failure detection, 12 MHz or 16
MHz needed for USB operations. Optional low-power 32.768 kHz for RTC or device clock
• RTC with Gregorian calendar mode, waveform generation in low-power modes
• RTC counter calibration circuitry compensates for 32.768 kHz crystal frequency variations
• 32-bit low-power Real-time Timer (RTT)
• High-precision Main RC oscillator with 12 MHz default frequency.
• 32.768 kHz crystal oscillator or Slow RC oscillator as source of low-power mode device clock (SLCK)
• One 500 MHz PLL for system clock, one 480 MHz PLL for USB high-speed operations
• Temperature Sensor
• One dual-port 24-channel central DMA Controller (XDMAC)
Low-Power Features
• Low-power sleep, wait and backup modes, with typical power consumption down to 1.1 μA in Backup mode with
RTC, RTT and wakeup logic enabled
• Ultra low-power RTC and RTT
• 1 Kbyte of backup RAM (BRAM) with dedicated regulator
Peripherals
©
2019 Microchip Technology Inc.
Datasheet
DS60001527D-page 1
SAM E70/S70/V70/V71 Family
•
One Ethernet MAC (GMAC) 10/100 Mbps in MII mode and RMII with dedicated DMA. IEEE1588 PTP frames
and 802.3az Energy-efficiency support. Ethernet AVB support with IEEE802.1AS Timestamping and
IEEE802.1Qav credit-based traffic-shaping hardware support.
USB 2.0 Device/Mini Host High-speed (USBHS) at 480 Mbps, 4-Kbyte FIFO, up to 10 bidirectional endpoints,
dedicated DMA
12-bit ITU-R BT. 601/656 Image Sensor Interface (ISI)
Two master Controller Area Networks (MCAN) with Flexible Data Rate (CAN-FD) with SRAM-based mailboxes,
time-triggered and event-triggered transmission
MediaLB
®
device with 3-wire mode, up to 1024 x Fs speed, supporting MOST25 and MOST50 networks
Three USARTs, USART0, USART1, USART2, support LIN mode, ISO7816, IrDA
®
, RS-485, SPI, Manchester
and Modem modes; USART1 supports LON mode.
Five 2-wire UARTs with SleepWalking
™
support
Three Two-Wire Interfaces (TWIHS) (I
2
C-compatible) with SleepWalking support
Quad I/O Serial Peripheral Interface (QSPI) interfacing up to 256 MB Flash and with eXecute-In-Place and on-
the-fly scrambling
Two Serial Peripheral Interfaces (SPI)
One Serial Synchronous Controller (SSC) with I
2
S and TDM support
Two Inter-IC Sound Controllers (I2SC)
One High-speed Multimedia Card Interface (HSMCI) (SDIO/SD Card/e.MMC)
Four Three-Channel 16-bit Timer/Counters (TC) with Capture, Waveform, Compare and PWM modes, constant
on time. Quadrature decoder logic and 2-bit Gray Up/Down Counter for stepper motor
Two 4-channel 16-bit PWMs with complementary outputs, Dead Time Generator and eight fault inputs per PWM
for motor control, two external triggers to manage power factor correction (PFC), DC-DC and lighting control.
Two Analog Front-End Controllers (AFEC), each supporting up to 12 channels with differential input mode and
programmable gain stage, allowing dual sample-and-hold (S&H) at up to 1.7 Msps. Offset and gain error
correction feature.
One 2-channel, 12-bit, 1 Msps-per-channel Digital-to-Analog Controller (DAC) with Differential and Over
Sampling modes
One Analog Comparator Controller (ACC) with flexible input selection, selectable input hysteresis
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Cryptography
• True Random Number Generator (TRNG)
• AES: 256-bit, 192-bit, 128-bit Key Algorithm, Compliant with FIPS PUB-197 Specifications
• Integrity Check Monitor (ICM). Supports Secure Hash Algorithm SHA1, SHA224 and SHA256.
I/O
• Up to 114 I/O lines with external interrupt capability (edge- or level-sensitivity), debouncing, glitch filtering and
On-die Series Resistor Termination
• Five Parallel Input/Output Controllers (PIO)
Voltage
• Single supply voltage from 3.0V to 3.6V for Qualification AEC - Q100 Grade 2 Devices
• Single Supply voltage from 1.7V to 3.6V for Industrial Temperature Devices
Packages
• LQFP144, 144-lead LQFP, 20x20 mm, pitch 0.5 mm
• LFBGA144, 144-ball LFBGA, 10x10 mm, pitch 0.8 mm
• TFBGA144, 144-ball TFBGA, 10x10 mm, pitch 0.8 mm
• UFBGA144, 144-ball UFBGA, 6x6 mm, pitch 0.4 mm
• LQFP100, 100-lead LQFP, 14x14 mm, pitch 0.5 mm
• TFBGA100, 100-ball TFBGA, 9x9 mm, pitch 0.8 mm
• VFBGA100, 100-ball VFBGA, 7x7 mm, pitch 0.65 mm
• LQFP64, 64-lead LQFP, 10x10 mm, pitch 0.5 mm
• QFN64, 64-pad QFN 9x9 mm, pitch 0.5 mm with wettable flanks
©
2019 Microchip Technology Inc.
Datasheet
DS60001527D-page 2
SAM E70/S70/V70/V71 Family
Table of Contents
Features......................................................................................................................................................... 1
1.
2.
3.
4.
5.
6.
Configuration Summary........................................................................................................................ 14
Ordering Information............................................................................................................................. 16
Block Diagram.......................................................................................................................................17
Signal Description................................................................................................................................. 21
Automotive Quality Grade..................................................................................................................... 28
Package and Pinout.............................................................................................................................. 29
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
7.
144-lead Packages.....................................................................................................................29
144-lead Package Pinout........................................................................................................... 30
100-lead Packages.....................................................................................................................36
100-lead Package Pinout........................................................................................................... 37
64-lead Package........................................................................................................................ 40
64-lead Package Pinout............................................................................................................. 40
Power Considerations........................................................................................................................... 44
7.1.
7.2.
7.3.
7.4.
7.5.
7.6.
7.7.
7.8.
Power Supplies.......................................................................................................................... 44
Power Constraints...................................................................................................................... 44
Voltage Regulator.......................................................................................................................45
Backup SRAM Power Switch..................................................................................................... 45
Active Mode................................................................................................................................46
Low-power Modes...................................................................................................................... 46
Wakeup Sources........................................................................................................................ 48
Fast Startup................................................................................................................................48
8.
Input/Output Lines.................................................................................................................................49
8.1.
8.2.
8.3.
8.4.
General-Purpose I/O Lines.........................................................................................................49
System I/O Lines........................................................................................................................ 49
NRST Pin................................................................................................................................... 50
ERASE Pin................................................................................................................................. 50
9.
Interconnect.......................................................................................................................................... 52
10. Product Mapping................................................................................................................................... 53
11. Memories.............................................................................................................................................. 54
11.1. Embedded Memories................................................................................................................. 54
11.2. External Memories..................................................................................................................... 60
12. Event System........................................................................................................................................ 61
12.1. Embedded Characteristics......................................................................................................... 61
12.2. Real-time Event Mapping........................................................................................................... 62
13. System Controller..................................................................................................................................66
13.1. System Controller and Peripherals Mapping..............................................................................66
©
2019 Microchip Technology Inc.
Datasheet
DS60001527D-page 3
SAM E70/S70/V70/V71 Family
13.2. Power-on-Reset, Brownout and Supply Monitor........................................................................ 66
13.3. Reset Controller......................................................................................................................... 66
14. Peripherals............................................................................................................................................ 67
14.1. Peripheral Identifiers.................................................................................................................. 67
14.2. Peripheral Signal Multiplexing on I/O Lines................................................................................69
15. ARM Cortex-M7 (ARM)......................................................................................................................... 70
15.1. ARM Cortex-M7 Configuration................................................................................................... 70
16. Debug and Test Features......................................................................................................................71
16.1.
16.2.
16.3.
16.4.
16.5.
16.6.
16.7.
Description................................................................................................................................. 71
Embedded Characteristics......................................................................................................... 71
Associated Documents...............................................................................................................71
Debug and Test Block Diagram..................................................................................................72
Debug and Test Pin Description................................................................................................. 72
Application Examples................................................................................................................. 73
Functional Description................................................................................................................74
17. SAM-BA Boot Program......................................................................................................................... 78
17.1.
17.2.
17.3.
17.4.
17.5.
17.6.
Description................................................................................................................................. 78
Embedded Characteristics......................................................................................................... 78
Hardware and Software Constraints.......................................................................................... 78
Flow Diagram............................................................................................................................. 78
Device Initialization.....................................................................................................................79
SAM-BA Monitor.........................................................................................................................79
18. Fast Flash Programming Interface (FFPI).............................................................................................83
18.1. Description................................................................................................................................. 83
18.2. Embedded Characteristics......................................................................................................... 83
18.3. Parallel Fast Flash Programming............................................................................................... 83
19. Bus Matrix (MATRIX).............................................................................................................................91
19.1.
19.2.
19.3.
19.4.
Description................................................................................................................................. 91
Embedded Characteristics......................................................................................................... 91
Functional Description................................................................................................................93
Register Summary......................................................................................................................97
20. USB Transmitter Macrocell Interface (UTMI)...................................................................................... 116
20.1. Description................................................................................................................................116
20.2. Embedded Characteristics....................................................................................................... 116
20.3. Register Summary....................................................................................................................117
21. Chip Identifier (CHIPID)...................................................................................................................... 120
21.1. Description............................................................................................................................... 120
21.2. Embedded Characteristics....................................................................................................... 120
21.3. Register Summary....................................................................................................................122
22. Enhanced Embedded Flash Controller (EEFC).................................................................................. 127
22.1. Description............................................................................................................................... 127
©
2019 Microchip Technology Inc.
Datasheet
DS60001527D-page 4
SAM E70/S70/V70/V71 Family
22.2.
22.3.
22.4.
22.5.
Embedded Characteristics....................................................................................................... 127
Product Dependencies............................................................................................................. 127
Functional Description..............................................................................................................127
Register Summary....................................................................................................................144
23. Supply Controller (SUPC)................................................................................................................... 152
23.1.
23.2.
23.3.
23.4.
23.5.
Description............................................................................................................................... 152
Embedded Characteristics....................................................................................................... 152
Block Diagram.......................................................................................................................... 153
Functional Description..............................................................................................................154
Register Summary....................................................................................................................165
24. Watchdog Timer (WDT).......................................................................................................................176
24.1.
24.2.
24.3.
24.4.
24.5.
Description............................................................................................................................... 176
Embedded Characteristics....................................................................................................... 176
Block Diagram.......................................................................................................................... 176
Functional Description..............................................................................................................177
Register Summary....................................................................................................................179
25. Reinforced Safety Watchdog Timer (RSWDT).................................................................................... 184
25.1.
25.2.
25.3.
25.4.
25.5.
Description............................................................................................................................... 184
Embedded Characteristics....................................................................................................... 184
Block Diagram.......................................................................................................................... 185
Functional Description..............................................................................................................185
Register Summary....................................................................................................................187
26. Reset Controller (RSTC)..................................................................................................................... 192
26.1.
26.2.
26.3.
26.4.
Description............................................................................................................................... 192
Embedded Characteristics....................................................................................................... 192
Block Diagram.......................................................................................................................... 192
Functional Description..............................................................................................................193
27. Real-time Clock (RTC)........................................................................................................................ 203
27.1.
27.2.
27.3.
27.4.
27.5.
27.6.
Description............................................................................................................................... 203
Embedded Characteristics....................................................................................................... 203
Block Diagram.......................................................................................................................... 203
Product Dependencies............................................................................................................. 204
Functional Description..............................................................................................................204
Register Summary....................................................................................................................212
28. Real-time Timer (RTT)........................................................................................................................ 230
28.1.
28.2.
28.3.
28.4.
28.5.
Description............................................................................................................................... 230
Embedded Characteristics....................................................................................................... 230
Block Diagram.......................................................................................................................... 230
Functional Description..............................................................................................................230
Register Summary....................................................................................................................233
29. General Purpose Backup Registers (GPBR)...................................................................................... 239
29.1. Description............................................................................................................................... 239
©
2019 Microchip Technology Inc.
Datasheet
DS60001527D-page 5
Special Edition for Assessment Centres
京公网安备 11010802033920号
EEWORLD
