8K X 8 SPI BUS SERIAL EEPROM, PDSO8, 4.40 MM, PLASTIC, TSSOP-8
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | 4.40 MM, PLASTIC, TSSOP-8 |
Contacts | 8 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Other features | DATA RETENTION > 200 YEARS; 4KV ESD PROTECTION; 1M ENDURANCE CYCLES |
Maximum clock frequency (fCLK) | 2 MHz |
Data retention time - minimum | 200 |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3 |
length | 4.4 mm |
memory density | 65536 bi |
Memory IC Type | EEPROM |
memory width | 8 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 8192 words |
character code | 8000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Serial bus type | SPI |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.5 V |
Nominal supply voltage (Vsup) | 2.7 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 3 mm |
Maximum write cycle time (tWC) | 5 ms |
Base Number Matches | 1 |