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M7A3P600-FGG144I

Description
Field Programmable Gate Array, 600000 Gates, 350MHz, 13824-Cell, CMOS, PBGA144, 1 MM PITCH, GREEN, FBGA-144
CategoryProgrammable logic devices    Programmable logic   
File Size3MB,246 Pages
ManufacturerActel
Websitehttp://www.actel.com/
Environmental Compliance
Download Datasheet Parametric View All

M7A3P600-FGG144I Overview

Field Programmable Gate Array, 600000 Gates, 350MHz, 13824-Cell, CMOS, PBGA144, 1 MM PITCH, GREEN, FBGA-144

M7A3P600-FGG144I Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerActel
package instruction1 MM PITCH, GREEN, FBGA-144
Reach Compliance Codecompli
maximum clock frequency350 MHz
JESD-30 codeS-PBGA-B144
JESD-609 codee1
length13 mm
Humidity sensitivity level3
Equivalent number of gates600000
Number of entries97
Number of logical units13824
Output times97
Number of terminals144
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize600000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA144,12X12,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
power supply1.8/2.5/3.3 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height1.55 mm
Maximum supply voltage1.575 V
Minimum supply voltage1.425 V
Nominal supply voltage1.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width13 mm
v2.1
ProASIC
®
3 Flash Family FPGAs
with Optional Soft ARM
®
Support
Features and Benefits
High Capacity
30 k to 1 Million System Gates
Up to 144 kbits of True Dual-Port SRAM
Up to 300 User I/Os
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
Live at Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
1 kbit of FlashROM with Synchronous Interfacing
350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI (except A3P030)
Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption (except A3P030 and ARM
®
-
enabled ProASIC
®
3 devices) via JTAG (IEEE 1532–
compliant)
FlashLock
®
to Secure FPGA Contents
Core Voltage for Low Power
Support for 1.5-V-Only Systems
Low-Impedance Flash Switches
Segmented, Hierarchical Routing and Clock Structure
Ultra-Fast Local and Long-Line Network
Enhanced High-Speed, Very-Long-Line Network
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
®
Advanced I/O
700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—Up to 4 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X (except
A3P030), and LVCMOS 2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, BLVDS, and
M-LVDS (A3P250 and above)
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os (A3P030 only)
Programmable Output Slew Rate (except A3P030) and
Drive Strength
Weak Pull-Up/Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages Across the ProASIC3 Family
Six CCC Blocks, One with an Integrated PLL
Configurable Phase-Shift, Multiply/Divide, Delay
Capabilities and External Feedback, Multiply/Divide,
Delay Capabilities, and External Feedback
Wide Input Frequency Range (1.5 MHz to 350 MHz)
CoreMP7Sd (with debug) and CoreMP7S (without debug
Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2,
×4, ×9, and ×18 Organizations Available)
True Dual-Port SRAM (except ×18)
24 SRAM and FIFO Configurations with Synchronous
Operation up to 350 MHz
CoreMP7Sd (with debug) and CoreMP7S (without
debug)
Reprogrammable Flash Technology
On-Chip User Nonvolatile Memory
High Performance
In-System Programming (ISP) and Security
Clock Conditioning Circuit (CCC) and PLL (except A3P030)
Low Power
SRAMs and FIFOs (except A3P030)
High-Performance Routing Hierarchy
Soft ARM7™ Core Support in M7 ProASIC3 Devices
Table 1 •
ProASIC3 Product Family
A3P030
A3P060
A3P125
A3P250
M7A3P250
30 k
768
1k
6
2
81
QN132
VQ100
60 k
1,536
18
4
1k
Yes
1
18
2
96
QN132
VQ100
TQ144
FG144
125 k
3,072
36
8
1k
Yes
1
18
2
133
QN132
VQ100
TQ144
PQ208
FG144
250 k
6,144
36
8
1k
Yes
1
18
4
157
QN132
5
VQ100
PQ208
FG144,
FG256
5
PQ208
FG144, FG256,
FG484
PQ208
FG144, FG256,
FG484
PQ208
FG144, FG256,
FG484
ProASIC3 Devices
ARM
®
-Enabled
ProASIC3 Devices
1
System Gates
VersaTiles (D-flip-flops)
RAM kbits (1,024 bits)
4,608-Bit Blocks
FlashROM Bits
Secure (AES) ISP
2
Integrated PLL in CCCs
VersaNet Globals
3
I/O Banks
Maximum User I/Os
Package Pins
QFN
VQFP
TQFP
PQFP
FBGA
A3P400
M7A3P400
400 k
9,216
54
12
1k
Yes
1
18
4
194
A3P600
M7A3P600
600 k
13,824
108
24
1k
Yes
1
18
4
235
A3P1000
M7A3P1000
1M
24,576
144
32
1k
Yes
1
18
4
300
Notes:
1. Refer to the
CoreMP7
datasheet for more information.
2. AES is not available for ARM-enabled ProASIC3 devices.
3. Six chip (main) and three quadrant global networks are available for A3P060 and above.
4. For higher densities and support of additional features, refer to the
ProASIC3E Flash FPGAs
datasheet.
5. The M7A3P250 device does not support this package.
May 2007
© 2007 Actel Corporation
i
See the Actel website for the latest version of the datasheet.
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