DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT
LM95235_08 | LM95235Q | LM95235CIMM | LM95235CIMMX | LM95235DIMM | LM95235DIMMX | LM95235EIMM | LM95235EIMMX | LM95235QEIMM | LM95235QEIMMX | |
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Description | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT | DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 2Cel, SQUARE, SURFACE MOUNT |
Is it Rohs certified? | - | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | - | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
package instruction | - | - | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 |
Reach Compliance Code | - | - | _compli | not_compliant | _compli | _compli | _compli | _compli | _compli | _compli |
ECCN code | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum accuracy (Celsius) | - | - | 2 Cel | 2 Cel | 2 Cel | 2 Cel | 2 Cel | 2 Cel | 2 Cel | 2 Cel |
body width | - | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
body height | - | - | 1.09 mm | 1.09 mm | 1.09 mm | 1.09 mm | 1.09 mm | 1.09 mm | 1.09 mm | 1.09 mm |
Body length or diameter | - | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
shell | - | - | PLASTIC | PLASTIC | PLASTIC | PLASTIC | PLASTIC | PLASTIC | PLASTIC | PLASTIC |
JESD-609 code | - | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Installation features | - | - | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
Number of digits | - | - | 11 | 11 | 11 | 11 | 11 | 11 | 11 | 11 |
Number of terminals | - | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Maximum working current | - | - | 0.35 mA | 0.35 mA | 0.35 mA | 0.35 mA | 0.35 mA | 0.35 mA | 0.35 mA | 0.35 mA |
Maximum operating temperature | - | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Output interface type | - | - | 2-WIRE INTERFACE | 2-WIRE INTERFACE | 2-WIRE INTERFACE | 2-WIRE INTERFACE | 2-WIRE INTERFACE | 2-WIRE INTERFACE | 2-WIRE INTERFACE | 2-WIRE INTERFACE |
Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Encapsulate equivalent code | - | - | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 | TSSOP8,.19 |
Package Shape/Form | - | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
power supply | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Maximum supply voltage | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage | - | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | - | - | YES | YES | YES | YES | YES | YES | YES | YES |
Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Termination type | - | - | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER |