EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342K09B5C17CWS

Description
RESISTOR, THIN FILM, 1 W, 0.1 %, 100 ppm, 5170000 ohm, SURFACE MOUNT, 2512, CHIP
CategoryPassive components    The resistor   
File Size111KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

M55342K09B5C17CWS Overview

RESISTOR, THIN FILM, 1 W, 0.1 %, 100 ppm, 5170000 ohm, SURFACE MOUNT, 2512, CHIP

M55342K09B5C17CWS Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerVishay
package instructionSMT, 2512
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresNON-INDUCTIIVE, LASER TRIMMABLE
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.254 mm
Package length6.579 mm
Package formSMT
Package width3.15 mm
method of packingWAFFLE PACK
Rated power dissipation(P)1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance5170000 Ω
Resistor typeFIXED RESISTOR
size code2512
surface mountYES
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage200 V
E/H (Military M/D55342)
Vishay Thin Film
QPL MIL-PRF-55342 Qualified Thin Film Resistor Chips
FEATURES
Established reliability, “R” failure rate level (100 ppm), C = 2
High purity alumina substrate 99.6 % purity
Wraparound termination featuring a tenacious adhesion
layer covered with an electroplated nickel barrier layer for
+ 150 °C operating conditions
Very low noise and voltage coefficient
(< - 25 dB, 0.5 ppm/V)
Non-inductive
Laser-trimmed tolerances ± 0.1 %
Wraparound resistance less than 0.010
Ω
typical
In-lot tracking less than 5 ppm/°C
Complete MIL-testing available in-house
Antistatic waffle pack or tape and reel packaging available
Military/aerospace/QPL
SURFACE MOUNT
CHIPS
Actual Size
M55342/02
Thin Film Mil chip resistors feature all sputtered wraparound
termination for excellent adhesion and dimensional
uniformity. They are ideal in applications requiring stringent
performance requirements. Established reliability is assured
through 100 % screening and extensive environmental lot
testing. Wafer is sawed producing exact dimensions and
clean, straight edges.
Note
Specification changed
MIL-PRF-55342
by
DSCC
from
MIL-R-55342
to
CONSTRUCTION
TYPICAL PERFORMANCE
ABS
Passivation
Resistor film
Solder
coating
Nickel barrier
High ourity
alumina substrate
Adhesion layer
TCR
TOL
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
Test
Material
Absolute TCR
Absolute Tolerance
Stability:
ΔR
Absolute
Voltage Coefficient
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability
SPECIFICATIONS
Passivated nichrome
± 25 ppm/°C to ± 300 ppm/°C TCR
± 0.1 %
± 0.1 %
± 0.5 ppm/V
- 55 °C to + 125 °C
- 55 °C to + 150 °C
- 25 dB
100 ppm
1 year at + 25 °C
- 55 °C to + 125 °C
+ 25 °C
2000 h at + 70 °C
CONDITIONS
www.vishay.com
50
For technical questions, contact:
thin-film@vishay.com
Document Number: 60018
Revision: 16-Sep-09
When AD software needs to drill vias to connect the network in the inner electrical layer segmentation, what is the minimum distance between the vias and the inner electrical layer segmentation edge?
When I used AD software to design a 6-layer board, I found a phenomenon. My fourth layer is the POWER layer, which divides the system power supply. When I need to drill vias for network connection, I ...
fangmian211 PCB Design
The United States is pressing forward: blacklisting 38 Huawei subsidiaries in an attempt to block Huawei's outsourcing of chips
Since Huawei was first included in the Entity List in May 2019, the total number of Huawei subsidiaries included in the US "Entity List" has reached 152. It's another restless night! Last night, the U...
eric_wang Talking
【GD32450I-EVAL】+ 06SDRAM Introduction
[i=s]This post was last edited by DDZZ669 on 2020-10-4 17:28[/i]1 SDRAMRAM can be understood as memory, the space required by the program when running. GD32F450IK comes with 256K RAM. When a large mem...
DDZZ669 GD32 MCU
【ST NUCLEO-H743ZI Review】(1)First impressions of ST NUCLEO-H743ZI
The development board ST NUCLEO-H743ZI evaluated in this event is provided by STMicroelectronics. Thanks to STMicroelectronics for supporting EEWorld's evaluation! Actually, I should have received the...
dsjsjf stm32/stm8
Keys? No more! The future of car access systems is here
As automotive design engineers begin to adopt technologies widely used in other industries, the way drivers enter their cars has become increasingly convenient. Throughout the industry's development, ...
EEWORLD社区 TI Technology Forum
[ESP32-Korvo Review] 05 Development Environment Construction Part 2
The previous review article explained the construction of the development environment, but it took a long time and failed: https://en.eeworld.com/bbs/thread-1158940-1-1.htmlToday is Friday. I got home...
天意无罪 Domestic Chip Exchange

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号