100102F-B datasheet, PDF - EEWORLD Datasheet

100102F-B: DescriptionOR/NOR Gate, ECL100K, CDIP24; Categorylogic logic; File Size248KB，5 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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100102F-B Overview

OR/NOR Gate, ECL100K, CDIP24

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP24,.4
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Logic integrated circuit type	OR/NOR GATE
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.4
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	-4.5 V
Maximum supply current (ICC)	80 mA
Prop。Delay @ Nom-Sup	1.4 ns
Schmitt trigger	NO
surface mount	NO
technology	ECL100K
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	100102F-B	100102A	100102Y
Description	OR/NOR Gate, ECL100K, CDIP24	OR/NOR Gate, ECL100K, PQCC28	OR/NOR Gate, ECL100K, CQFP24
Is it Rohs certified?	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.4	QCCJ, LDCC28,.5SQ	QFF, QFL24,.4SQ
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-XDIP-T24	S-PQCC-J28	S-XQFP-F24
JESD-609 code	e0	e0	e0
Logic integrated circuit type	OR/NOR GATE	OR/NOR GATE	OR/NOR GATE
Number of terminals	24	28	24
Maximum operating temperature	85 °C	85 °C	85 °C
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	QCCJ	QFF
Encapsulate equivalent code	DIP24,.4	LDCC28,.5SQ	QFL24,.4SQ
Package shape	RECTANGULAR	SQUARE	SQUARE
Package form	IN-LINE	CHIP CARRIER	FLATPACK
power supply	-4.5 V	-4.5 V	-4.5 V
Maximum supply current (ICC)	80 mA	80 mA	80 mA
Prop。Delay @ Nom-Sup	1.4 ns	1.2 ns	1.2 ns
Schmitt trigger	NO	NO	NO
surface mount	NO	YES	YES
technology	ECL100K	ECL100K	ECL100K
Temperature level	OTHER	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	FLAT
Terminal pitch	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	QUAD
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-
Is Samacsys	-	N	N
Certification status	-	Not Qualified	Not Qualified
Base Number Matches	-	1	1

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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