MEMORY MODULE,SRAM,4X64KX36,BICMOS-TTL,SSIM,80PIN,PLASTIC
Parameter Name | Attribute value |
Maker | NXP |
package instruction | SIMM, SSIM80(UNSPEC) |
Reach Compliance Code | unknown |
Maximum access time | 17 ns |
I/O type | COMMON |
JESD-30 code | R-PSMA-N80 |
memory density | 9437184 bit |
Memory IC Type | CACHE TAG SRAM MODULE |
memory width | 36 |
Number of terminals | 80 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX36 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SIMM |
Encapsulate equivalent code | SSIM80(UNSPEC) |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum slew rate | 1.75 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal location | SINGLE |
MCM44C256SG17 | MCM44C256SG12 | MCM44D256SG12 | |
---|---|---|---|
Description | MEMORY MODULE,SRAM,4X64KX36,BICMOS-TTL,SSIM,80PIN,PLASTIC | MEMORY MODULE,SRAM,4X64KX36,BICMOS-TTL,SSIM,80PIN,PLASTIC | MEMORY MODULE,SRAM,8X32KX36,BICMOS-TTL,SSIM,80PIN,PLASTIC |
Maker | NXP | NXP | NXP |
package instruction | SIMM, SSIM80(UNSPEC) | SIMM, SSIM80(UNSPEC) | SIMM, SSIM80(UNSPEC) |
Reach Compliance Code | unknown | unknown | unknown |
Maximum access time | 17 ns | 12 ns | 12 ns |
I/O type | COMMON | COMMON | COMMON |
JESD-30 code | R-PSMA-N80 | R-PSMA-N80 | R-PSMA-N80 |
memory density | 9437184 bit | 9437184 bit | 9437184 bit |
Memory IC Type | CACHE TAG SRAM MODULE | CACHE TAG SRAM MODULE | CACHE TAG SRAM MODULE |
memory width | 36 | 36 | 36 |
Number of terminals | 80 | 80 | 80 |
word count | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 256KX36 | 256KX36 | 256KX36 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SIMM | SIMM | SIMM |
Encapsulate equivalent code | SSIM80(UNSPEC) | SSIM80(UNSPEC) | SSIM80(UNSPEC) |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum slew rate | 1.75 mA | 1.75 mA | 1.75 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD |
Terminal location | SINGLE | SINGLE | SINGLE |