X25F087PI datasheet, PDF - EEWORLD Datasheet

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X25F087PI: DescriptionFlash, 1KX8, PDIP8, MINI, PLASTIC, DIP-8; Categorystorage storage; File Size230KB，13 Pages; ManufacturerXicor Inc.

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X25F087PI Overview

Flash, 1KX8, PDIP8, MINI, PLASTIC, DIP-8

X25F087PI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Xicor Inc.
package instruction	MINI, PLASTIC, DIP-8
Reach Compliance Code	unknown
Other features	SPI SERIAL FLASH
Maximum clock frequency (fCLK)	1 MHz
Data retention time - minimum	100
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	10.03 mm
memory density	8192 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	8
word count	1024 words
character code	1000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
power supply	2/3.3 V
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	4.32 mm
Serial bus type	SPI
Maximum standby current	0.000001 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
type	NOR TYPE
width	7.62 mm
write protect	HARDWARE/SOFTWARE

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X25F087

SPI SerialFlash with Block Lock

Protection

DESCRIPTION

1024 x 8 Bit

FEATURES

• 1MHz Clock Rate

• SPI Modes (0,0 & 1,1)

• 1024 x 8 Bits

—16 Byte Small Sector Program Mode

• Low Power CMOS

—<1

A Standby Current

—<3mA Active Current during Program

—<400

A Active Current during Read

• 1.8V to 3.6V or 5V “Univolt” Read and Program

Power Supply Versions

• Block Lock Protection

—Block Lock Protect 0, any 1/4, 1st 1/2, First or

Last Sector of SerialFlash Array

• Built-in Inadvertent Program Protection

—Power-Up/Power-Down Protection Circuitry

—Program Enable Latch

—Program Protect Pin

• Self-Timed Program Cycle

—5ms Program Cycle Time (Typical)

• High Reliability

—Endurance: 100,000 Cycles/Byte

—Data Retention: 100 Years

—ESD: 2000V on all pins

• 8-Lead SOIC Package

• 8-Lead TSSOP Package

• 8-Pin Mini-DIP Package

FUNCTIONAL DIAGRAM

COMMAND

DECODE

AND

CONTROL

LOGIC

The X25F087 is a CMOS 8k-bit SerialFlash, internally

organized as 1024 x 8. The X25F087 features a Serial

Peripheral Interface (SPI) and software protocol

allowing operation on a simple four-wire bus. The bus

signals are a clock input (SCK) plus separate data in (SI)

and data out (SO) lines. Access to the device is

controlled through a chip select (CS) input, allowing any

number of devices to share the same bus.

There are eight options for programmable, nonvolatile,

Block Lock Protection available to the end user. These

options are implemented via special instructions

programmed to the part. The X25F087 also features a

PP pin that can be used for hardwire protection of the

part, disabling all programming attempts, as well as a

Program Enable Latch that must be set before a program

operation can be initiated.

The X25F087 utilizes Xicor’s proprietary Direct Write

cell, providing a minimum endurance of 100,000 cycles

per sector and a minimum data retention of 100 years.

DATA REGISTER

Y DECODE LOGIC

SCK

DECODE

LOGIC

SERIALFLASH

ARRAY

(1024 x 8)

PROGRAM CONTROL LOGIC

HIGH VOLTAGE

CONTROL

7007 FRM 01

Xicor, Inc. 1994, 1995, 1996 Patents Pending

7007-0.7 5/8/97 T1/C0/D0 SH

Characteristics subject to change without notice

X25F087PI Related Products

	X25F087PI	X25F087S	X25F087SI-5	X25F087SI	X25F087S-5	X25F087PI-5	X25F087V	X25F087VI	X25F087P
Description	Flash, 1KX8, PDIP8, MINI, PLASTIC, DIP-8	Flash, 1KX8, PDSO8, PLASTIC, SOIC-8	Flash, 1KX8, PDSO8, PLASTIC, SOIC-8	Flash, 1KX8, PDSO8, PLASTIC, SOIC-8	Flash, 1KX8, PDSO8, PLASTIC, SOIC-8	Flash, 1KX8, PDIP8, MINI, PLASTIC, DIP-8	Flash, 1KX8, PDSO8, PLASTIC, TSSOP-8	Flash, 1KX8, PDSO8, PLASTIC, TSSOP-8	Flash, 1KX8, PDIP8, MINI, PLASTIC, DIP-8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	MINI, PLASTIC, DIP-8	PLASTIC, SOIC-8	PLASTIC, SOIC-8	PLASTIC, SOIC-8	PLASTIC, SOIC-8	MINI, PLASTIC, DIP-8	PLASTIC, TSSOP-8	PLASTIC, TSSOP-8	MINI, PLASTIC, DIP-8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum clock frequency (fCLK)	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz	1 MHz
Data retention time - minimum	100	100	100	100	100	100	100	100	100
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	10.03 mm	4.9 mm	4.9 mm	4.9 mm	4.9 mm	10.03 mm	4.4 mm	4.4 mm	10.03 mm
memory density	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8	8	8
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000	1000	1000	1000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-	-40 °C	-	-40 °C	-
organize	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	SOP	SOP	DIP	TSSOP	TSSOP	DIP
Encapsulate equivalent code	DIP8,.3	SOP8,.25	SOP8,.25	SOP8,.25	SOP8,.25	DIP8,.3	TSSOP8,.25	TSSOP8,.25	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
power supply	2/3.3 V	2/3.3 V	5 V	2/3.3 V	5 V	5 V	2/3.3 V	2/3.3 V	2/3.3 V
Programming voltage	1.8 V	1.8 V	5 V	1.8 V	5 V	5 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.32 mm	1.75 mm	1.75 mm	1.75 mm	1.75 mm	4.32 mm	1.2 mm	1.2 mm	4.32 mm
Serial bus type	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI
Maximum standby current	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A
Maximum slew rate	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	5.5 V	3.6 V	5.5 V	5.5 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	4.5 V	1.8 V	4.5 V	4.5 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	5 V	3.3 V	5 V	5 V	3.3 V	3.3 V	3.3 V
surface mount	NO	YES	YES	YES	YES	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	0.65 mm	0.65 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	7.62 mm	3.9 mm	3.9 mm	3.9 mm	3.9 mm	7.62 mm	3 mm	3 mm	7.62 mm
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
Maker	Xicor Inc.	-	-	-	-	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.
Other features	SPI SERIAL FLASH	SPI SERIAL FLASH	SPI SERIAL FLASH	SPI SERIAL FLASH	SPI SERIAL FLASH	SPI SERIAL FLASH	-	-	SPI SERIAL FLASH

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