AS7C33512NTD32A-166TQC datasheet, PDF

AS7C33512NTD32A-166TQC: Description3.3V 512K x 32/36 Pipelined SRAM with NTD; Categorystorage storage; File Size408KB，18 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

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AS7C33512NTD32A-166TQC Overview

3.3V 512K x 32/36 Pipelined SRAM with NTD

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	QFP
package instruction	LQFP, QFP100,.63X.87
Contacts	100
Reach Compliance Code	unknow
ECCN code	3A991.B.2.A
Maximum access time	3.4 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	16777216 bi
Memory IC Type	ZBT SRAM
memory width	32
Number of functions	1
Number of terminals	100
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.04 A
Minimum standby current	3.14 V
Maximum slew rate	0.3 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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