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TMP82C55A

Description
CMOS PROGRAMMABLE PERIPHERAL INTERFACE
File Size793KB,39 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TMP82C55A Overview

CMOS PROGRAMMABLE PERIPHERAL INTERFACE

TMP82C55A Related Products

TMP82C55A TMP82C55AP-10 TMP82C55AP-2 TMP82C55AM-10 TMP82C55AM-2
Description CMOS PROGRAMMABLE PERIPHERAL INTERFACE CMOS PROGRAMMABLE PERIPHERAL INTERFACE CMOS PROGRAMMABLE PERIPHERAL INTERFACE CMOS PROGRAMMABLE PERIPHERAL INTERFACE CMOS PROGRAMMABLE PERIPHERAL INTERFACE
Is it Rohs certified? - incompatible incompatible incompatible incompatible
Maker - Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor
Parts packaging code - DIP DIP SSOP SSOP
package instruction - DIP, DIP, SSOP, SSOP,
Contacts - 40 40 40 40
Reach Compliance Code - unknow unknow unknow unknow
ECCN code - EAR99 EAR99 EAR99 EAR99
External data bus width - 8 8 8 8
JESD-30 code - R-PDIP-T40 R-PDIP-T40 R-PDSO-G40 R-PDSO-G40
JESD-609 code - e0 e0 e0 e0
length - 50.7 mm 50.7 mm 17.5 mm 17.5 mm
Number of I/O lines - 24 24 24 24
Number of ports - 3 3 3 3
Number of terminals - 40 40 40 40
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - DIP DIP SSOP SSOP
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - IN-LINE IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 4.8 mm 4.8 mm 2.8 mm 2.8 mm
Maximum slew rate - 5 mA 5 mA 5 mA 5 mA
Maximum supply voltage - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage - 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage - 5 V 5 V 5 V 5 V
surface mount - NO NO YES YES
technology - CMOS CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING
Terminal pitch - 2.54 mm 2.54 mm 0.8 mm 0.8 mm
Terminal location - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 15.24 mm 15.24 mm 8.8 mm 8.8 mm
uPs/uCs/peripheral integrated circuit type - PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE

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