CMOS PROGRAMMABLE PERIPHERAL INTERFACE
TMP82C55A | TMP82C55AP-10 | TMP82C55AP-2 | TMP82C55AM-10 | TMP82C55AM-2 | |
---|---|---|---|---|---|
Description | CMOS PROGRAMMABLE PERIPHERAL INTERFACE | CMOS PROGRAMMABLE PERIPHERAL INTERFACE | CMOS PROGRAMMABLE PERIPHERAL INTERFACE | CMOS PROGRAMMABLE PERIPHERAL INTERFACE | CMOS PROGRAMMABLE PERIPHERAL INTERFACE |
Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible |
Maker | - | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
Parts packaging code | - | DIP | DIP | SSOP | SSOP |
package instruction | - | DIP, | DIP, | SSOP, | SSOP, |
Contacts | - | 40 | 40 | 40 | 40 |
Reach Compliance Code | - | unknow | unknow | unknow | unknow |
ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 |
External data bus width | - | 8 | 8 | 8 | 8 |
JESD-30 code | - | R-PDIP-T40 | R-PDIP-T40 | R-PDSO-G40 | R-PDSO-G40 |
JESD-609 code | - | e0 | e0 | e0 | e0 |
length | - | 50.7 mm | 50.7 mm | 17.5 mm | 17.5 mm |
Number of I/O lines | - | 24 | 24 | 24 | 24 |
Number of ports | - | 3 | 3 | 3 | 3 |
Number of terminals | - | 40 | 40 | 40 | 40 |
Maximum operating temperature | - | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | DIP | DIP | SSOP | SSOP |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | - | 4.8 mm | 4.8 mm | 2.8 mm | 2.8 mm |
Maximum slew rate | - | 5 mA | 5 mA | 5 mA | 5 mA |
Maximum supply voltage | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | - | 5 V | 5 V | 5 V | 5 V |
surface mount | - | NO | NO | YES | YES |
technology | - | CMOS | CMOS | CMOS | CMOS |
Temperature level | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
Terminal pitch | - | 2.54 mm | 2.54 mm | 0.8 mm | 0.8 mm |
Terminal location | - | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | - | 15.24 mm | 15.24 mm | 8.8 mm | 8.8 mm |
uPs/uCs/peripheral integrated circuit type | - | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |