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AS7C251MPFS32A-133TQC

Description
2.5V 1M x 32/36 pipelined burst synchronous SRAM
Categorystorage    storage   
File Size509KB,19 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
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AS7C251MPFS32A-133TQC Overview

2.5V 1M x 32/36 pipelined burst synchronous SRAM

AS7C251MPFS32A-133TQC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerALSC [Alliance Semiconductor Corporation]
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time3.8 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density33554432 bi
Memory IC TypeSTANDARD SRAM
memory width32
Number of functions1
Number of terminals100
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.06 A
Minimum standby current2.38 V
Maximum slew rate0.325 mA
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm

AS7C251MPFS32A-133TQC Related Products

AS7C251MPFS32A-133TQC AS7C251MPFS32A AS7C251MPFS32A-133TQI AS7C251MPFS32A-133TQCN AS7C251MPFS32A-133TQIN AS7C251MPFS32A-200TQIN AS7C251MPFS36A AS7C251MPFS36A-133TQCN AS7C251MPFS36A-133TQI
Description 2.5V 1M x 32/36 pipelined burst synchronous SRAM 2.5V 1M x 32/36 pipelined burst synchronous SRAM 2.5V 1M x 32/36 pipelined burst synchronous SRAM 2.5V 1M x 32/36 pipelined burst synchronous SRAM 2.5V 1M x 32/36 pipelined burst synchronous SRAM 2.5V 1M x 32/36 pipelined burst synchronous SRAM 2.5V 1M x 32/36 pipelined burst synchronous SRAM 2.5V 1M x 32/36 pipelined burst synchronous SRAM 2.5V 1M x 32/36 pipelined burst synchronous SRAM
Is it Rohs certified? incompatible - incompatible conform to conform to conform to - conform to incompatible
Maker ALSC [Alliance Semiconductor Corporation] - ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] - ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation]
Parts packaging code QFP - QFP QFP QFP QFP - QFP QFP
package instruction LQFP, QFP100,.63X.87 - LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 - LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87
Contacts 100 - 100 100 100 100 - 100 100
Reach Compliance Code unknow - unknow unknow unknow unknow - unknow unknow
ECCN code 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A - 3A991.B.2.A 3A991.B.2.A
Maximum access time 3.8 ns - 3.8 ns 3.8 ns 3.8 ns 3.1 ns - 3.8 ns 3.8 ns
Other features PIPELINED ARCHITECTURE - PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE - PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK) 133 MHz - 133 MHz 133 MHz 133 MHz 200 MHz - 133 MHz 133 MHz
I/O type COMMON - COMMON COMMON COMMON COMMON - COMMON COMMON
JESD-30 code R-PQFP-G100 - R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 - R-PQFP-G100 R-PQFP-G100
JESD-609 code e0 - e0 e3 e3 e3 - e3 e0
length 20 mm - 20 mm 20 mm 20 mm 20 mm - 20 mm 20 mm
memory density 33554432 bi - 33554432 bi 33554432 bi 33554432 bi 33554432 bi - 37748736 bi 37748736 bi
Memory IC Type STANDARD SRAM - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM - STANDARD SRAM STANDARD SRAM
memory width 32 - 32 32 32 32 - 36 36
Number of functions 1 - 1 1 1 1 - 1 1
Number of terminals 100 - 100 100 100 100 - 100 100
word count 1048576 words - 1048576 words 1048576 words 1048576 words 1048576 words - 1048576 words 1048576 words
character code 1000000 - 1000000 1000000 1000000 1000000 - 1000000 1000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C - 85 °C 70 °C 85 °C 85 °C - 70 °C 85 °C
organize 1MX32 - 1MX32 1MX32 1MX32 1MX32 - 1MX36 1MX36
Output characteristics 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE - 3-STATE 3-STATE
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP - LQFP LQFP LQFP LQFP - LQFP LQFP
Encapsulate equivalent code QFP100,.63X.87 - QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 - QFP100,.63X.87 QFP100,.63X.87
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE - FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE - FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL - PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED 245 245 245 - 245 NOT SPECIFIED
power supply 2.5 V - 2.5 V 2.5 V 2.5 V 2.5 V - 2.5 V 2.5 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.6 mm - 1.6 mm 1.6 mm 1.6 mm 1.6 mm - 1.6 mm 1.6 mm
Maximum standby current 0.06 A - 0.06 A 0.06 A 0.06 A 0.06 A - 0.06 A 0.06 A
Minimum standby current 2.38 V - 2.38 V 2.38 V 2.38 V 2.38 V - 2.38 V 2.38 V
Maximum slew rate 0.325 mA - 0.325 mA 0.325 mA 0.325 mA 0.4 mA - 0.325 mA 0.325 mA
Maximum supply voltage (Vsup) 2.625 V - 2.625 V 2.625 V 2.625 V 2.625 V - 2.625 V 2.625 V
Minimum supply voltage (Vsup) 2.375 V - 2.375 V 2.375 V 2.375 V 2.375 V - 2.375 V 2.375 V
Nominal supply voltage (Vsup) 2.5 V - 2.5 V 2.5 V 2.5 V 2.5 V - 2.5 V 2.5 V
surface mount YES - YES YES YES YES - YES YES
technology CMOS - CMOS CMOS CMOS CMOS - CMOS CMOS
Temperature level COMMERCIAL - INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL - COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) MATTE TIN MATTE TIN MATTE TIN - MATTE TIN Tin/Lead (Sn/Pb)
Terminal form GULL WING - GULL WING GULL WING GULL WING GULL WING - GULL WING GULL WING
Terminal pitch 0.65 mm - 0.65 mm 0.65 mm 0.65 mm 0.65 mm - 0.65 mm 0.65 mm
Terminal location QUAD - QUAD QUAD QUAD QUAD - QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED 30 30 30 - 30 NOT SPECIFIED
width 14 mm - 14 mm 14 mm 14 mm 14 mm - 14 mm 14 mm
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