AS7C251MPFS36A datasheet, PDF - EEWORLD Datasheet

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AS7C251MPFS36A: Description2.5V 1M x 32/36 pipelined burst synchronous SRAM; File Size509KB，19 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

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AS7C251MPFS36A Overview

2.5V 1M x 32/36 pipelined burst synchronous SRAM

AS7C251MPFS36A Related Products

	AS7C251MPFS36A	AS7C251MPFS32A	AS7C251MPFS32A-133TQC	AS7C251MPFS32A-133TQI	AS7C251MPFS32A-133TQCN	AS7C251MPFS32A-133TQIN	AS7C251MPFS32A-200TQIN	AS7C251MPFS36A-133TQCN	AS7C251MPFS36A-133TQI
Description	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM	2.5V 1M x 32/36 pipelined burst synchronous SRAM
Is it Rohs certified?	-	-	incompatible	incompatible	conform to	conform to	conform to	conform to	incompatible
Maker	-	-	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	-	-	QFP	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	-	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	-	-	100	100	100	100	100	100	100
Reach Compliance Code	-	-	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	-	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	-	-	3.8 ns	3.8 ns	3.8 ns	3.8 ns	3.1 ns	3.8 ns	3.8 ns
Other features	-	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	-	-	133 MHz	133 MHz	133 MHz	133 MHz	200 MHz	133 MHz	133 MHz
I/O type	-	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	-	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	-	-	e0	e0	e3	e3	e3	e3	e0
length	-	-	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
memory density	-	-	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bi	37748736 bi	37748736 bi
Memory IC Type	-	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	-	-	32	32	32	32	32	36	36
Number of functions	-	-	1	1	1	1	1	1	1
Number of terminals	-	-	100	100	100	100	100	100	100
word count	-	-	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	-	-	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	-	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	-	70 °C	85 °C	70 °C	85 °C	85 °C	70 °C	85 °C
organize	-	-	1MX32	1MX32	1MX32	1MX32	1MX32	1MX36	1MX36
Output characteristics	-	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
Encapsulate equivalent code	-	-	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	-	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	-	-	NOT SPECIFIED	NOT SPECIFIED	245	245	245	245	NOT SPECIFIED
power supply	-	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	-	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	-	-	0.06 A	0.06 A	0.06 A	0.06 A	0.06 A	0.06 A	0.06 A
Minimum standby current	-	-	2.38 V	2.38 V	2.38 V	2.38 V	2.38 V	2.38 V	2.38 V
Maximum slew rate	-	-	0.325 mA	0.325 mA	0.325 mA	0.325 mA	0.4 mA	0.325 mA	0.325 mA
Maximum supply voltage (Vsup)	-	-	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V
Minimum supply voltage (Vsup)	-	-	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V
Nominal supply voltage (Vsup)	-	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	-	-	YES	YES	YES	YES	YES	YES	YES
technology	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	MATTE TIN	MATTE TIN	MATTE TIN	MATTE TIN	Tin/Lead (Sn/Pb)
Terminal form	-	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	-	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	-	-	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	NOT SPECIFIED	30	30	30	30	NOT SPECIFIED
width	-	-	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

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