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935283189112

Description
8 I/O, PIA-GENERAL PURPOSE, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size177KB,32 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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935283189112 Overview

8 I/O, PIA-GENERAL PURPOSE, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20

935283189112 Parametric

Parameter NameAttribute value
MakerNXP
package instructionLSSOP,
Reach Compliance Codeunknown
ECCN codeEAR99
JESD-30 codeR-PDSO-G20
length6.5 mm
Number of I/O lines8
Number of ports1
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Maximum seat height1.5 mm
Maximum supply voltage5.5 V
Minimum supply voltage2.3 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
width4.4 mm
uPs/uCs/peripheral integrated circuit typePARALLEL IO PORT, GENERAL PURPOSE
PCA9674/74A
Remote 8-bit I/O expander for Fm+ I
2
C-bus with interrupt
Rev. 05 — 15 June 2009
Product data sheet
1. General description
The PCA9674/74A provide general purpose remote I/O expansion for most
microcontroller families via the two-line bidirectional bus (I
2
C-bus) and is a part of the
Fast-mode Plus (Fm+) family.
The PCA9674/74A is a drop-in upgrade for the PCF8574/74A providing higher Fast-mode
Plus I
2
C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWM
dimming of LEDs, higher I
2
C-bus drive (30 mA versus 3 mA) so that many more devices
can be on the bus without the need for bus buffers, higher total package sink capacity
(200 mA versus 100 mA) that supports having all LEDs on at the same time and more
device addresses (64 versus 8) are available to allow many more devices on the bus
without address conflicts.
The devices consist of an 8-bit quasi-bidirectional port and an I
2
C-bus interface. The
PCA9674/74A have low current consumption and include latched outputs with 25 mA high
current drive capability for directly driving LEDs.
They also possess an interrupt line (INT) that can be connected to the interrupt logic of
the microcontroller. By sending an interrupt signal on this line, the remote I/O can inform
the microcontroller if there is incoming data on its ports without having to communicate via
the I
2
C-bus.
The internal Power-On Reset (POR) or Software Reset sequence initializes the I/Os as
inputs.
2. Features
I
I
I
I
I
I
I
I
I
I
I
I
I
1 MHz I
2
C-bus interface
Compliant with the I
2
C-bus Fast and Standard modes
SDA with 30 mA sink capability for 4000 pF buses
2.3 V to 5.5 V operation with 5.5 V tolerant I/Os
8-bit remote I/O pins that default to inputs at power-up
Latched outputs with 25 mA sink capability for directly driving LEDs
Total package sink capability of 200 mA
Active LOW open-drain interrupt output
64 programmable slave addresses using 3 address pins
Readable device ID (manufacturer, device type, and revision)
Low standby current
−40 °C
to +85
°C
operation
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101

935283189112 Related Products

935283189112 935282744112 935282744118 935283189118
Description 8 I/O, PIA-GENERAL PURPOSE, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20 8 I/O, PIA-GENERAL PURPOSE, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20 8 I/O, PIA-GENERAL PURPOSE, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20 8 I/O, PIA-GENERAL PURPOSE, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20
Maker NXP NXP NXP NXP
package instruction LSSOP, LSSOP, LSSOP, LSSOP,
Reach Compliance Code unknown unknow unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99
JESD-30 code R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
length 6.5 mm 6.5 mm 6.5 mm 6.5 mm
Number of I/O lines 8 8 8 8
Number of ports 1 1 1 1
Number of terminals 20 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSSOP LSSOP LSSOP LSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Maximum seat height 1.5 mm 1.5 mm 1.5 mm 1.5 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage 3 V 3 V 3 V 3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL
width 4.4 mm 4.4 mm 4.4 mm 4.4 mm
uPs/uCs/peripheral integrated circuit type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
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