512K(64Kx8)CMOS FLASH MEMORY
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Intel |
| Parts packaging code | DIP |
| package instruction | DIP, DIP32,.6 |
| Contacts | 32 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 120 ns |
| Other features | 100000 ERASE/PROGRAM CYCLES |
| command user interface | YES |
| Data polling | NO |
| Durability | 1000 Write/Erase Cycles |
| JESD-30 code | R-PDIP-T32 |
| JESD-609 code | e0 |
| length | 41.91 mm |
| memory density | 524288 bi |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 64KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP32,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programming voltage | 12 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.83 mm |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| switch bit | NO |
| type | NOR TYPE |
| width | 15.24 mm |
| TP28F512-120 | 28F512 | TN28F512-120 | P28F512-120 | P28F512-150 | N28F512-150 | N28F512-120 | |
|---|---|---|---|---|---|---|---|
| Description | 512K(64Kx8)CMOS FLASH MEMORY | 512K(64Kx8)CMOS FLASH MEMORY | 512K(64Kx8)CMOS FLASH MEMORY | 512K(64Kx8)CMOS FLASH MEMORY | 512K(64Kx8)CMOS FLASH MEMORY | 512K(64Kx8)CMOS FLASH MEMORY | 512K(64Kx8)CMOS FLASH MEMORY |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Intel | - | Intel | Intel | Intel | Intel | Intel |
| Parts packaging code | DIP | - | QFJ | DIP | DIP | QFJ | QFJ |
| package instruction | DIP, DIP32,.6 | - | 0.450 X 0.550 INCH, PLASTIC, LCC-32 | DIP, DIP32,.6 | DIP, DIP32,.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
| Contacts | 32 | - | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow |
| ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 120 ns | - | 120 ns | 120 ns | 150 ns | 150 ns | 120 ns |
| Other features | 100000 ERASE/PROGRAM CYCLES | - | 100000 ERASE/PROGRAM CYCLES | 100000 ERASE/PROGRAM CYCLES | 100000 ERASE/PROGRAM CYCLES | 100000 ERASE/PROGRAM CYCLES | 100000 ERASE/PROGRAM CYCLES |
| command user interface | YES | - | YES | YES | YES | YES | YES |
| Data polling | NO | - | NO | NO | NO | NO | NO |
| Durability | 1000 Write/Erase Cycles | - | 1000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
| JESD-30 code | R-PDIP-T32 | - | R-PQCC-J32 | R-PDIP-T32 | R-PDIP-T32 | R-PQCC-J32 | R-PQCC-J32 |
| JESD-609 code | e0 | - | e0 | e0 | e0 | e0 | e0 |
| length | 41.91 mm | - | 13.97 mm | 41.91 mm | 41.91 mm | 13.97 mm | 13.97 mm |
| memory density | 524288 bi | - | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi |
| Memory IC Type | FLASH | - | FLASH | FLASH | FLASH | FLASH | FLASH |
| memory width | 8 | - | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | - | 32 | 32 | 32 | 32 | 32 |
| word count | 65536 words | - | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | 64000 | - | 64000 | 64000 | 64000 | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | - | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 64KX8 | - | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| Output characteristics | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | - | QCCJ | DIP | DIP | QCCJ | QCCJ |
| Encapsulate equivalent code | DIP32,.6 | - | LDCC32,.5X.6 | DIP32,.6 | DIP32,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | - | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 12 V | - | 12 V | 12 V | 12 V | 12 V | 12 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.83 mm | - | 3.55 mm | 4.83 mm | 4.83 mm | 3.55 mm | 3.55 mm |
| Maximum standby current | 0.0001 A | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.03 mA | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | - | YES | NO | NO | YES | YES |
| technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | - | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | - | QUAD | DUAL | DUAL | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| switch bit | NO | - | NO | NO | NO | NO | NO |
| type | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| width | 15.24 mm | - | 11.43 mm | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm |
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