MT18KDF51272PDZ-1G1XX datasheet, PDF

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MT18KDF51272PDZ-1G1XX: DescriptionDDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240; Categorystorage storage; File Size409KB，21 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT18KDF51272PDZ-1G1XX Overview

DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240

MT18KDF51272PDZ-1G1XX Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	DIMM
package instruction	HALOGEN FREE, MO-269, RDIMM-240
Contacts	240
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240
memory density	38654705664 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	240
word count	536870912 words
character code	512000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512MX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.45 V
Minimum supply voltage (Vsup)	1.283 V
Nominal supply voltage (Vsup)	1.35 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	DUAL

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4GB, 8GB (x72, ECC, DR) 240-Pin 1.35V DDR3L VLP RDIMM

Features

1.35V DDR3L SDRAM VLP RDIMM

MT18KDF51272PDZ – 4GB

MT18KDF1G72PDZ – 8GB

Features

• DDR3L functionality and operations supported as

defined in the component data sheet

• 240-pin, registered dual in-line, very-low-profile

memory module (VLP RDIMM)

• Fast data transfer rates: PC3-12800, PC3-10600,

PC3-8500, or PC3-6400

• 4GB (512 Meg x 72), 8GB (1 Gig x 72)

• V

= 1.35V (1.283–1.45V)

• V

= 1.5V (1.425–1.575V)

• Backward-compatible to V

= 1.5V ±0.075V

• V

DDSPD

= 3.0–3.6V

• Supports ECC error detection and correction

• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Dual-rank

• On-board I

C temperature sensor with integrated

serial presence-detect (SPD) EEPROM

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Gold edge contacts

• Halogen-free

• Fly-by topology

• Terminated control, command, and address bus

Table 1: Key Timing Parameters

Speed

Grade

-1G6

-1G4

-1G1

-1G0

-80B

Industry

Nomenclature

PC3-12800

PC3-10600

PC3-8500

PC3-6400

Data Rate (MT/s)

CL = 11 CL = 10

1600

–

1333

–

CL = 9

1333

–

CL = 8

1066

–

CL = 7

1066

–

CL = 6

800

CL = 5

667

RCD

Figure 1: 240-Pin RDIMM (MO-269 R/C L)

Module height: 18.75mm (0.738in)

Options

• Operating

– Commercial (0°C

≤

+70°C)

– Industrial (–40°C

≤

+85°C)

• Package

– 240-pin DIMM (halogen-free)

• Frequency/CAS latency

– 1.25ns @ CL = 11 (DDR3-1600)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.87ns @ CL = 7 (DDR3-1066)

Note:

temperature

Marking

None

-1G6

-1G4

-1G1

1. Contact Micron for industrial temperature

module offerings.

(ns)

13.125

(ns)

13.125

(ns)

48.125

49.125

50.625

52.5

PDF: 09005aef847d79ed

kdf18c512_1Gx72pdz - Rev. G 4/13 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT18KDF51272PDZ-1G1XX Related Products

	MT18KDF51272PDZ-1G1XX	MT18KDF51272PDZ-1G6XX	MT18KDF51272PDZ-1G4XX
Description	DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240
Maker	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	DIMM	DIMM	DIMM
package instruction	HALOGEN FREE, MO-269, RDIMM-240	DIMM,	HALOGEN FREE, MO-269, RDIMM-240
Contacts	240	240	240
Reach Compliance Code	unknown	compliant	unknown
ECCN code	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240
memory density	38654705664 bit	38654705664 bit	38654705664 bit
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	72	72	72
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	240	240	240
word count	536870912 words	536870912 words	536870912 words
character code	512000000	512000000	512000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	512MX72	512MX72	512MX72
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES
Maximum supply voltage (Vsup)	1.45 V	1.45 V	1.45 V
Minimum supply voltage (Vsup)	1.283 V	1.283 V	1.283 V
Nominal supply voltage (Vsup)	1.35 V	1.35 V	1.35 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL

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