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QG80333M800,SL8CE

Description
Micro Peripheral IC, PBGA829,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,75 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Environmental Compliance
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QG80333M800,SL8CE Overview

Micro Peripheral IC, PBGA829,

QG80333M800,SL8CE Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIntel
package instructionBGA, BGA829,29X29,50
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B829
Number of terminals829
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA829,29X29,50
Package shapeSQUARE
Package formGRID ARRAY
power supply1.35,1.5,1.8/2.5,3.3 V
Certification statusNot Qualified
surface mountYES
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM

QG80333M800,SL8CE Preview

Intel
®
80333 I/O Processor
Datasheet
Product Features
Integrated Intel XScale
®
core
— 500, 667 and 800 MHz
— ARM* V5TE Compliant
— 32 KByte, 32-way Set Associative
Instruction Cache with cache locking
— 32 KByte, 32-way Set Associative Data
Cache with cache locking. Supports
write through or write back
— 2 KByte, 2-way Set Associative Mini-
Data Cache
— 128-Entry Branch Target Buffer
— 8-Entry Write Buffer
— 4-Entry Fill and Pend Buffer
— Performance Monitor Unit
Internal Bus 333 MHz/64-bit
PCI Express*-to-PCI Bridges
— x8 PCI Express* Upstream Link
— PCI Express* Specification 1.0a
compliant
— PCI-X Bus A (IOP bus - ATU interface)
— PCI-X Bus B (Slot Expansion bus)
supports standard PCI Hot-Plug
Controller
— Four output clocks per PCI-X bus
Address Translation Unit
— 2 KB or 4 KB Outbound Read Queue
— 4 KB Outbound Write Queue
— 4 KB Inbound Read and Write Queue
— Connects Internal Bus to PCI/X Bus A
— Messaging Unit and Expansion ROM
Two Programmable 32-bit Timers and
Watchdog Timer
Eight General Purpose I/O Pins
Two I
2
C Bus Interface Units
Dual-Ported Memory Controller
— PC2700 Double Data Rate (DDR333)
SDRAM
— DDRII 400 SDRAM
— Up to 2 GB of 64-bit DDR333
— Up to 1 GB of 64-bit DDRII400
— Optional Single-bit Error Correction,
Multi-bit Detection Support (ECC)
— Supports Unbuffered or Registered
DIMMs and Discrete SDRAM
— 32-bit memory support
DMA Controller
— Two Independent Channels Connected
to Internal Bus
— Two 1KB Queues in Ch0 and Ch1
— CRC-32C Calculation
Application Accelerator Unit
— RAID6 support
— Performs optional XOR on Read Data
— Compute Parity Across Local Memory
Blocks
— 1 KB/512 byte Store Queue
Two UART (16550) Units
— 64-byte Receive and Transmit FIFOs
— 4-pin, Master/Slave Capable
Peripheral Bus Interface
— 8-/16-bit Data Bus with Two Chip Selects
Interrupt Controller Unit
— Four Priority Levels
— Vector Generation
— Sixteen External Interrupt Pins with
High Priority Interrupt (HPI#)
829-Ball, Flip Chip Ball Grid Array (FCBGA)
— 37.5 mm
2
and 1.27 mm ball pitch
Order Number: 305433, Revision: 003US
July 2005
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or
in nuclear facility applications.
Legal Lines and Disclaimers
Intel may make changes to specifications and product descriptions at any time, without notice.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the
presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by
estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at
http://www.intel.com.
AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, CT Media, Dialogic, DM3, EtherExpress, ETOX, FlashFile, i386, i486,
i960, iCOMP, InstantIP, Intel, Intel Centrino, Intel logo, Intel386, Intel486, Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Create & Share, Intel GigaBlade,
Intel InBusiness, Intel Inside, Intel Inside logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel Play, Intel Play logo, Intel SingleDriver, Intel
SpeedStep, Intel StrataFlash, Intel TeamStation, Intel Xeon, Intel XScale, IPLink, Itanium, MCS, MMX, MMX logo, Optimizer logo, OverDrive,
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trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005, Intel Corporation. All Rights Reserved.
July 2005
2
Intel
®
80333 I/O Processor Datasheet
Order Number: 305433, Revision: 003US
Datasheet
80333
Contents
1.0
Introduction....................................................................................................................................
7
1.1
About This Document ........................................................................................................... 7
1.1.1 Terminology ............................................................................................................. 7
1.1.2 Other Relevant Documents ..................................................................................... 8
About the Intel
®
80333 I/O Processor................................................................................... 9
Intel XScale
®
Core..............................................................................................................11
PCI Express*-to-PCI Bridge Units ......................................................................................11
Address Translation Unit ....................................................................................................12
Memory Controller ..............................................................................................................12
Application Accelerator Unit................................................................................................12
Peripheral Bus Interface .....................................................................................................12
DMA Controller ...................................................................................................................13
I
2
C Bus Interface Unit .........................................................................................................13
Messaging Unit ...................................................................................................................13
Internal Bus.........................................................................................................................13
UART Units .........................................................................................................................13
Interrupt Controller Unit ......................................................................................................14
GPIO ...................................................................................................................................14
SMBus Unit .........................................................................................................................14
Functional Signal Descriptions ...........................................................................................15
Package Thermal Specifications ........................................................................................55
Absolute Maximum Ratings ................................................................................................56
V
CCPLL
Pin Requirements...................................................................................................56
Targeted DC Specifications ................................................................................................57
Targeted AC Specifications ................................................................................................59
4.4.1 Clock Signal Timings .............................................................................................59
4.4.2 DDR/DDR-II SDRAM Interface Signal Timings......................................................61
4.4.3 Peripheral Bus Interface Signal Timings................................................................63
4.4.4 I
2
C/SMBus Interface Signal Timings......................................................................65
4.4.5 UART Interface Signal Timings..............................................................................65
4.4.6 PCI Express* Differential Transmitter (Tx) Output Specifications..........................66
4.4.7 PCI Express* Differential Receiver (Rx) Input Specifications ................................67
4.4.8 Boundary Scan Test Signal Timings......................................................................68
AC Timing Waveforms ........................................................................................................69
AC Test Conditions.............................................................................................................73
1.2
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
3.0
3.1
3.2
4.0
4.1
4.2
4.3
4.4
Features........................................................................................................................................11
Package Information
...................................................................................................................15
Electrical Specifications
.............................................................................................................56
4.5
4.6
Figures
1
2
Intel
®
80333 I/O Processor Functional Block Diagram ...............................................................10
829-Ball FCBGA Package Diagram............................................................................................37
Datasheet
Intel
®
80333 I/O Processor Datasheet
Order Number: 305433, Revision: 003US
July 2005
3
80333
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Intel
®
80333 I/O Processor Signal Group Locations (Bottom View) ........................................... 38
Intel
®
80333 I/O Processor Ballout — Left Side (Bottom View) ................................................. 39
Intel
®
80333 I/O Processor Ballout — Right Side (Bottom View) ............................................... 40
Clock Timing Measurement Waveforms..................................................................................... 69
Output Timing Measurement Waveforms ................................................................................... 69
Input Timing Measurement Waveforms...................................................................................... 70
I
2
C/SMBus Interface Signal Timings .......................................................................................... 70
UART Transmitter Receiver Timing............................................................................................ 70
DDR SDRAM Write Timings ....................................................................................................... 71
DDR SDRAM Read Timings....................................................................................................... 71
Write PreAmble/PostAmble Durations........................................................................................ 72
AC Test Load for All Signals Except PCI and DDR SDRAM ...................................................... 73
AC Test Load for DDR SDRAM Signals ..................................................................................... 73
PCI/PCI-X TOV(max) Rising Edge AC Test Load ...................................................................... 73
PCI/PCI-X TOV(max) Falling Edge AC Test Load ..................................................................... 74
PCI/PCI-X TOV(min) AC Test Load ........................................................................................... 74
Transmitter Test Load (100
differential load) .......................................................................... 74
Transmitter Eye Diagram............................................................................................................ 75
Receiver Eye Opening (Differential) ........................................................................................... 75
Tables
1
2
4
3
5
6
7
8
10
9
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Pin Description Nomenclature .................................................................................................... 15
DDR SDRAM Signals ................................................................................................................. 16
MISC SDRAM Signals ................................................................................................................ 17
DDR-II SDRAM Signals .............................................................................................................. 17
Peripheral Bus Interface Signals ................................................................................................ 18
PCI Express* Signals ................................................................................................................. 19
B PCI (Slot Expansion) Bus Signals ........................................................................................... 20
A PCI (IOP) Bus Signals............................................................................................................. 22
I
2
C/SMBus Signals ..................................................................................................................... 24
Interrupt Signals ......................................................................................................................... 24
Hot-Plug Controller Signals for Parallel 1-slot, No-Glue ............................................................. 25
UART Signals ............................................................................................................................. 26
Test and Miscellaneous Signals ................................................................................................. 28
Reset Strap Signals .................................................................................................................... 29
Power and Ground Pins ............................................................................................................. 31
Pin Mode Behavior ..................................................................................................................... 32
Pin Multiplexing for Functional Modes ........................................................................................ 36
FC-style, H-PBGA Package Dimensions.................................................................................... 37
829-Lead Package — Alphabetical Ball Listings ........................................................................ 41
829-Lead Package — Alphabetical Signal Listings .................................................................... 48
Absolute Maximum Ratings ........................................................................................................ 56
Operating Conditions .................................................................................................................. 56
DC Characteristics...................................................................................................................... 57
I
CC
Characteristics...................................................................................................................... 58
PCI Clock Timings ...................................................................................................................... 59
DDR Clock Timings .................................................................................................................... 59
PCI Express* Clock Timings....................................................................................................... 60
DDR SDRAM Signal Timings ..................................................................................................... 61
July 2005
4
Intel
®
80333 I/O Processor Datasheet
Order Number: 305433, Revision: 003US
Datasheet
80333
29
30
31
32
33
34
35
36
37
DDR-II SDRAM Signal Timings ..................................................................................................62
Peripheral Bus Signal Timings....................................................................................................63
PCI Signal Timings .....................................................................................................................64
I
2
C/SMBus Signal Timings .........................................................................................................65
UART Signal Timings .................................................................................................................65
PCI Express* Tx Output Specifications ......................................................................................66
PCI Express* Rx Input Specifications.........................................................................................67
Boundary Scan Test Signal Timings...........................................................................................68
AC Measurement Conditions......................................................................................................73
Datasheet
Intel
®
80333 I/O Processor Datasheet
Order Number: 305433, Revision: 003US
July 2005
5

QG80333M800,SL8CE Related Products

QG80333M800,SL8CE NQ80333M500,SL82B NQ80333M500,Q010 NQ80333M667,Q011 NQ80333M667,SL82C NQ80333M800,Q012 QG80333M500,Q108 QG80333M500,SL8CC QG80333M667,Q109 QG80333M667,SL8CD
Description Micro Peripheral IC, PBGA829, Micro Peripheral IC, PBGA829, Micro Peripheral IC, PBGA829 Micro Peripheral IC, PBGA829 Micro Peripheral IC, PBGA829 Micro Peripheral IC, PBGA829 Micro Peripheral IC, PBGA829 Micro Peripheral IC, PBGA829, Micro Peripheral IC, PBGA829 Micro Peripheral IC, PBGA829,
Maker Intel Intel Intel Intel Intel Intel Intel Intel Intel Intel
package instruction BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
JESD-30 code S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829
Number of terminals 829 829 829 829 829 829 829 829 829 829
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
power supply 1.35,1.5,1.8/2.5,3.3 V 1.35,1.5,1.8/2.5,3.3 V 1.35,1.5,1.8/2.5,3.3 V 1.35,1.5,1.8/2.5,3.3 V 1.35,1.5,1.8/2.5,3.3 V 1.35,1.5,1.8/2.5,3.3 V 1.35,1.5,1.8/2.5,3.3 V 1.35,1.5,1.8/2.5,3.3 V 1.35,1.5,1.8/2.5,3.3 V 1.35,1.5,1.8/2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES YES YES YES YES YES
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
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