MK30DX128ZVLQ10 datasheet, PDF

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MK30DX128ZVLQ10: Description32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，74 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MK30DX128ZVLQ10 Overview

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144

MK30DX128ZVLQ10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFP
package instruction	20 X 20 MM, LQFP-144
Contacts	144
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Has ADC	YES
Address bus width
bit size	32
CPU series	CORTEX-M4
maximum clock frequency	50 MHz
DAC channel	YES
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G144
length	20 mm
Number of I/O lines	100
Number of terminals	144
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP144,.87SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
power supply	1.8/3.3 V
Certification status	Not Qualified
RAM (bytes)	32768
rom(word)	131072
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	100 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	1.71 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: K30P144M100SF2

Rev. 7, 02/2013

Supports the following:

MK30DX128ZVLQ10,

MK30DX128ZVMD10,

MK30DX256ZVLQ10,

MK30DX256ZVMD10,

MK30DN512ZVLQ10,

MK30DN512ZVMD10

K30 Sub-Family Data Sheet

K30P144M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power

optimization based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 63

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Segment LCD controller supporting up to 40

frontplanes and 8 backplanes, or 44 frontplanes and

4 backplanes, depending on the package size

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64)

integrated into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts...........................................................................4

1.1 Determining valid orderable parts......................................4

2 Part identification......................................................................4

2.1 Description.........................................................................4

2.2 Format...............................................................................4

2.3 Fields.................................................................................4

2.4 Example............................................................................5

3 Terminology and guidelines......................................................5

3.1 Definition: Operating requirement......................................5

3.2 Definition: Operating behavior...........................................6

3.3 Definition: Attribute............................................................6

3.4 Definition: Rating...............................................................7

3.5 Result of exceeding a rating..............................................7

3.6 Relationship between ratings and operating

requirements......................................................................7

3.7 Guidelines for ratings and operating requirements............8

3.8 Definition: Typical value.....................................................8

3.9 Typical value conditions....................................................9

4 Ratings......................................................................................10

4.1 Thermal handling ratings...................................................10

4.2 Moisture handling ratings..................................................10

4.3 ESD handling ratings.........................................................10

4.4 Voltage and current operating ratings...............................10

5 General.....................................................................................11

5.1 AC electrical characteristics..............................................11

5.2 Nonswitching electrical specifications...............................11

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.8

Voltage and current operating requirements.........11

LVD and POR operating requirements.................12

Voltage and current operating behaviors..............13

Power mode transition operating behaviors..........15

Power consumption operating behaviors..............16

EMC radiated emissions operating behaviors.......19

Designing with radiated emissions in mind...........20

Capacitance attributes..........................................20

6.8.3

6.8.4

6.8.5

6.8.6

6.8.7

5.4.2

Thermal attributes.................................................22

6 Peripheral operating requirements and behaviors....................23

6.1 Core modules....................................................................23

6.1.1

6.1.2

Debug trace timing specifications.........................23

JTAG electricals....................................................24

6.2 System modules................................................................27

6.3 Clock modules...................................................................27

6.3.1

6.3.2

6.3.3

MCG specifications...............................................27

Oscillator electrical specifications.........................29

32 kHz Oscillator Electrical Characteristics...........31

6.4 Memories and memory interfaces.....................................32

6.4.1

6.4.2

6.4.3

Flash electrical specifications................................32

EzPort Switching Specifications............................34

Flexbus Switching Specifications..........................35

6.5 Security and integrity modules..........................................38

6.6 Analog...............................................................................38

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications.................................38

CMP and 6-bit DAC electrical specifications.........46

12-bit DAC electrical characteristics.....................48

Voltage reference electrical specifications............51

6.7 Timers................................................................................52

6.8 Communication interfaces.................................................52

6.8.1

6.8.2

CAN switching specifications................................52

DSPI switching specifications (limited voltage

range)....................................................................53

DSPI switching specifications (full voltage range).54

Inter-Integrated Circuit Interface (I2C) timing........56

UART switching specifications..............................57

SDHC specifications.............................................57

I2S switching specifications..................................58

6.9 Human-machine interfaces (HMI)......................................61

6.9.1

6.9.2

TSI electrical specifications...................................61

LCD electrical characteristics................................62

7 Dimensions...............................................................................63

7.1 Obtaining package dimensions.........................................63

8 Pinout........................................................................................63

8.1 K30 Signal Multiplexing and Pin Assignments..................63

8.2 K30 Pinouts.......................................................................69

9 Revision History........................................................................71

5.3 Switching specifications.....................................................20

5.3.1

5.3.2

Device clock specifications...................................20

General switching specifications...........................20

5.4 Thermal specifications.......................................................21

5.4.1

Thermal operating requirements...........................21

K30 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.

Freescale Semiconductor, Inc.

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